XC3S1400AN-4FGG676C Xilinx Inc, XC3S1400AN-4FGG676C Datasheet - Page 77

• Manufacturer Part Number: XC3S1400AN-4FGG676C
• Description: IC SPARTAN-3AN FPGA 1400K 676FBG
• Manufacturer: Xilinx Inc
• Series: Spartan™-3ANr

Specifications of XC3S1400AN-4FGG676C

• Total Ram Bits: 589824
• Number Of Logic Elements/cells: 25344
• Number Of Labs/clbs: 2816
• Number Of I /o: 502
• Number Of Gates: 1400000
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C
• Package / Case: 676-BBGA
• No. Of Logic Blocks: 25344
• No. Of Gates: 1400000
• No. Of Macrocells: 25344
• Family Type: Spartan-3AN
• No. Of Speed Grades: 4
• No. Of I/o's: 502
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 122-1552

User I/Os by Bank
Table 69
The AWAKE pin is counted as a dual-purpose I/O.
Table 69: User I/Os Per Bank for the XC3S50AN in the TQG144 Package
Footprint Migration Differences
The XC3S50AN FPGA is the only Spartan-3AN device offered in the TQG144 package. The XC3S50AN FPGA is pin
compatible with the Spartan-3A XC3S50A FPGA in the TQ(G)144 package, although the Spartan-3A FPGA requires an
external configuration source.
DS557 (v4.1) April 1, 2011
Product Specification
Top
Right
Bottom
Left
Package
Edge
Total
indicates how the 108 available user-I/O pins are distributed between the four I/O banks on the TQG144 package.
I/O Bank
0
1
2
3
Maximum I/Os
108
27
25
30
26
I/O
14
11
15
42
2
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INPUT
1
0
0
1
2
All Possible I/O Pins by Type
Spartan-3AN FPGA Family: Pinout Descriptions
DUAL
21
26
1
4
0
VREF
3
2
1
2
8
CLK
30
8
8
6
8
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