EP1C6F256I7 Altera, EP1C6F256I7 Datasheet - Page 4

• Manufacturer Part Number: EP1C6F256I7
• Description: IC CYCLONE FPGA 5980 LE 256-FBGA
• Manufacturer: Altera
• Series: Cyclone®r

Specifications of EP1C6F256I7

• Number Of Logic Elements/cells: 5980
• Number Of Labs/clbs: 598
• Total Ram Bits: 92160
• Number Of I /o: 185
• Voltage - Supply: 1.425 V ~ 1.575 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C
• Package / Case: 256-FBGA
• Family Name: Cyclone®
• Number Of Logic Blocks/elements: 5980
• # I/os (max): 185
• Frequency (max): 320.1MHz
• Process Technology: 0.13um (CMOS)
• Operating Supply Voltage (typ): 1.5V
• Logic Cells: 5980
• Ram Bits: 92160
• Operating Supply Voltage (min): 1.425V
• Operating Supply Voltage (max): 1.575V
• Operating Temp Range: -40C to 100C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 256
• Package Type: FBGA
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Number Of Gates: -
• Lead Free Status / Rohs Status: Not Compliant
• Other names: 544-1021

Cyclone Device Handbook, Volume 1
1–2
Preliminary
Note to
(1)
Notes to
(1)
(2)
Total RAM bits
PLLs
Maximum user I/O pins
EP1C3
EP1C4
EP1C6
EP1C12
EP1C20
Table 1–1. Cyclone Device Features (Part 2 of 2)
Table 1–2. Cyclone Package Options and I/O Pin Counts
Device
This parameter includes global clock pins.
TQFP: thin quad flat pack.
PQFP: plastic quad flat pack.
Cyclone devices support vertical migration within the same package (i.e., designers can migrate between the
EP1C3 device in the 144-pin TQFP package and the EP1C6 device in the same package).
Table
Table
Feature
1–1:
100-Pin TQFP
1–2:
(1)
65
—
—
—
—
(1)
Cyclone devices are available in quad flat pack (QFP) and space-saving
FineLine
Vertical migration means you can migrate a design from one device to
another that has the same dedicated pins, JTAG pins, and power pins, and
are subsets or supersets for a given package across device densities. The
largest density in any package has the highest number of power pins; you
must use the layout for the largest planned density in a package to
provide the necessary power pins for migration.
For I/O pin migration across densities, cross-reference the available I/O
pins using the device pin-outs for all planned densities of a given package
type to identify which I/O pins can be migrated. The Quartus
software can automatically cross-reference and place all pins for you
when given a device migration list. If one device has power or ground
pins, but these same pins are user I/O on a different device that is in the
migration path,the Quartus II software ensures the pins are not used as
user I/O in the Quartus II software. Ensure that these pins are connected
144-Pin TQFP
(1),
104
98
—
—
—
(2)
59,904
EP1C3
®
104
BGA packages (see
1
240-Pin PQFP
185
173
(1)
—
—
—
78,336
EP1C4
301
2
FineLine BGA
Tables 1–2
256-Pin
185
185
—
—
—
92,160
EP1C6
185
2
through 1–3).
FineLine BGA
324-Pin
239,616
EP1C12
249
249
233
—
—
249
2
Altera Corporation
FineLine BGA
400-Pin
®
294,912
EP1C20
May 2008
301
301
II
301
—
—
—
2