EP1C6F256I7 Altera, EP1C6F256I7 Datasheet - Page 7

IC CYCLONE FPGA 5980 LE 256-FBGA

EP1C6F256I7

Manufacturer Part Number
EP1C6F256I7
Description
IC CYCLONE FPGA 5980 LE 256-FBGA
Manufacturer
Altera
Series
Cyclone®r
Datasheet

Specifications of EP1C6F256I7

Number Of Logic Elements/cells
5980
Number Of Labs/clbs
598
Total Ram Bits
92160
Number Of I /o
185
Voltage - Supply
1.425 V ~ 1.575 V
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 100°C
Package / Case
256-FBGA
Family Name
Cyclone®
Number Of Logic Blocks/elements
5980
# I/os (max)
185
Frequency (max)
320.1MHz
Process Technology
0.13um (CMOS)
Operating Supply Voltage (typ)
1.5V
Logic Cells
5980
Ram Bits
92160
Operating Supply Voltage (min)
1.425V
Operating Supply Voltage (max)
1.575V
Operating Temp Range
-40C to 100C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
256
Package Type
FBGA
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Number Of Gates
-
Lead Free Status / Rohs Status
Not Compliant
Other names
544-1021

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Functional
Description
Altera Corporation
May 2008
C51002-1.6
Cyclone
architecture to implement custom logic. Column and row interconnects
of varying speeds provide signal interconnects between LABs and
embedded memory blocks.
The logic array consists of LABs, with 10 LEs in each LAB. An LE is a
small unit of logic providing efficient implementation of user logic
functions. LABs are grouped into rows and columns across the device.
Cyclone devices range between 2,910 to 20,060 LEs.
M4K RAM blocks are true dual-port memory blocks with 4K bits of
memory plus parity (4,608 bits). These blocks provide dedicated true
dual-port, simple dual-port, or single-port memory up to 36-bits wide at
up to 250 MHz. These blocks are grouped into columns across the device
in between certain LABs. Cyclone devices offer between 60 to 288 Kbits of
embedded RAM.
Each Cyclone device I/O pin is fed by an I/O element (IOE) located at the
ends of LAB rows and columns around the periphery of the device. I/O
pins support various single-ended and differential I/O standards, such as
the 66- and 33-MHz, 64- and 32-bit PCI standard and the LVDS I/O
standard at up to 640 Mbps. Each IOE contains a bidirectional I/O buffer
and three registers for registering input, output, and output-enable
signals. Dual-purpose DQS, DQ, and DM pins along with delay chains
(used to phase-align DDR signals) provide interface support with
external memory devices such as DDR SDRAM, and FCRAM devices at
up to 133 MHz (266 Mbps).
Cyclone devices provide a global clock network and up to two PLLs. The
global clock network consists of eight global clock lines that drive
throughout the entire device. The global clock network can provide
clocks for all resources within the device, such as IOEs, LEs, and memory
blocks. The global clock lines can also be used for control signals. Cyclone
PLLs provide general-purpose clocking with clock multiplication and
phase shifting as well as external outputs for high-speed differential I/O
support.
Figure 2–1
®
devices contain a two-dimensional row- and column-based
shows a diagram of the Cyclone EP1C12 device.
2. Cyclone Architecture
Preliminary
2–1

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