EPF10K100ABC356-3 Altera, EPF10K100ABC356-3 Datasheet - Page 13

IC FLEX 10KA FPGA 100K 356-BGA

EPF10K100ABC356-3

Manufacturer Part Number
EPF10K100ABC356-3
Description
IC FLEX 10KA FPGA 100K 356-BGA
Manufacturer
Altera
Series
FLEX-10K®r
Datasheet

Specifications of EPF10K100ABC356-3

Number Of Logic Elements/cells
624
Number Of Labs/clbs
624
Total Ram Bits
24576
Number Of I /o
274
Number Of Gates
158000
Voltage - Supply
3 V ~ 3.6 V
Mounting Type
Surface Mount
Operating Temperature
0°C ~ 85°C
Package / Case
356-BGA
Family Name
FLEX 10KA
Number Of Usable Gates
100000
Number Of Logic Blocks/elements
4992
# Registers
1218
# I/os (max)
274
Frequency (max)
125MHz
Process Technology
CMOS
Operating Supply Voltage (typ)
3.3V
Logic Cells
4992
Ram Bits
24567
Device System Gates
158000
Operating Supply Voltage (min)
3V
Operating Supply Voltage (max)
3.6V
Operating Temp Range
0C to 70C
Operating Temperature Classification
Commercial
Mounting
Surface Mount
Pin Count
356
Package Type
BGA
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Other names
544-2191

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Altera Corporation
Figure 5. FLEX 10K LAB
Notes:
(1)
(2)
LAB Local
Interconnect (2)
EPF10K10, EPF10K10A, EPF10K20, EPF10K30, EPF10K30A, EPF10K40, EPF10K50, and EPF10K50V devices have
22 inputs to the LAB local interconnect channel from the row; EPF10K70, EPF10K100, EPF10K100A, EPF10K130V,
and EPF10K250A devices have 26.
EPF10K10, EPF10K10A, EPF10K20, EPF10K30, EPF10K30A, EPF10K40, EPF10K50, and EPF10K50V devices have
30 LAB local interconnect channels; EPF10K70, EPF10K100, EPF10K100A, EPF10K130V, and EPF10K250A devices
have 34 LABs.
LAB Control
Signals
(1)
Logic Array Block
Each LAB consists of eight LEs, their associated carry and cascade chains,
LAB control signals, and the LAB local interconnect. The LAB provides
the coarse-grained structure to the FLEX 10K architecture, facilitating
efficient routing with optimum device utilization and high performance.
See
4
4
4
4
4
4
4
4
4
8
Figure
Dedicated Inputs &
Global Signals
FLEX 10K Embedded Programmable Logic Device Family Data Sheet
5.
4
6
Carry-In &
Cascade-In
LE1
LE2
LE3
LE4
LE5
LE6
LE7
LE8
2
2
Row Interconnect
Carry-Out &
Cascade-Out
8
16
24
8
4
16
See Figure 11
for details.
Column
Interconnect
Column-to-Row
Interconnect
13

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