EP1SGX40DF1020C6N Altera, EP1SGX40DF1020C6N Datasheet - Page 184

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EP1SGX40DF1020C6N

Manufacturer Part Number
EP1SGX40DF1020C6N
Description
IC STRATIX GX FPGA 40K 1020-FBGA
Manufacturer
Altera
Series
Stratix® GXr
Datasheet

Specifications of EP1SGX40DF1020C6N

Number Of Logic Elements/cells
41250
Number Of Labs/clbs
4125
Total Ram Bits
3423744
Number Of I /o
624
Voltage - Supply
1.425 V ~ 1.575 V
Mounting Type
Surface Mount
Operating Temperature
0°C ~ 85°C
Package / Case
1020-FBGA
Family Name
Stratix GX
Number Of Logic Blocks/elements
41250
# I/os (max)
624
Frequency (max)
5GHz
Process Technology
SRAM
Operating Supply Voltage (typ)
1.5V
Logic Cells
41250
Ram Bits
3423744
Operating Supply Voltage (min)
1.425V
Operating Supply Voltage (max)
1.575V
Operating Temp Range
0C to 85C
Operating Temperature Classification
Commercial
Mounting
Surface Mount
Pin Count
1020
Package Type
FC-FBGA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Number Of Gates
-
Lead Free Status / Rohs Status
Compliant

Available stocks

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Part Number
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Quantity
Price
Part Number:
EP1SGX40DF1020C6N
Manufacturer:
Altera
Quantity:
10 000
Part Number:
EP1SGX40DF1020C6N
Manufacturer:
ALTERA
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Part Number:
EP1SGX40DF1020C6N
Manufacturer:
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Quantity:
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I/O Structure
4–118
Stratix GX Device Handbook, Volume 1
SSTL-3 class II
AGP (1
CTT
Table 4–28. I/O Support by Bank (Part 2 of 2)
×
I/O Standard
and 2
×
)
Each I/O bank has its own VCCIO pins. A single device can support 1.5-,
1.8-, 2.5-, and 3.3-V interfaces; each bank can support a different standard
independently. Each bank also has dedicated VREF pins to support any
one of the voltage-referenced standards (such as SSTL-3) independently.
Each I/O bank can support multiple standards with the same V
input and output pins. Each bank can support one voltage-referenced
I/O standard. For example, when V
LVTTL, LVCMOS, 3.3-V PCI, and SSTL-3 for inputs and outputs.
Differential On-Chip Termination
Stratix GX devices provide differential on-chip termination (LVDS I/O
standard) to reduce reflections and maintain signal integrity. Differential
on-chip termination simplifies board design by minimizing the number
of external termination resistors required. Termination can be placed
inside the package, eliminating small stubs that can still lead to
reflections. The internal termination is designed using transistors in the
linear region of operation.
Stratix GX devices support internal differential termination with a
nominal resistance value of 137.5 Ω for LVDS input receiver buffers.
LVPECL signals require an external termination resistor.
shows the device with differential termination.
Top & Bottom Banks
(3, 4, 7 & 8)
v
v
v
Left Banks
(1 & 2)
v
v
CCIO
is 3.3 V, a bank can support
Enhanced PLL External
Clock Output Banks
(9, 10, 11 & 12)
Altera Corporation
Figure 4–70
February 2005
v
v
v
CCIO
for

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