XC3SD1800A-4FGG676C Xilinx Inc, XC3SD1800A-4FGG676C Datasheet - Page 72

• Manufacturer Part Number: XC3SD1800A-4FGG676C
• Description: SPARTAN-3ADSP FPGA 1800K 676FBGA
• Manufacturer: Xilinx Inc
• Series: Spartan™-3A DSPr

Specifications of XC3SD1800A-4FGG676C

• Total Ram Bits: 1548288
• Number Of Logic Elements/cells: 37440
• Number Of Labs/clbs: 4160
• Number Of I /o: 519
• Number Of Gates: 1800000
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C
• Package / Case: 676-BBGA
• No. Of Logic Blocks: 4224
• No. Of Gates: 1800000
• No. Of Macrocells: 37440
• Family Type: Spartan-3A
• No. Of Speed Grades: 4
• No. Of I/o's: 519
• Clock: RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: 122-1574 - KIT DEVELOPMENT SPARTAN 3ADSP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 122-1538

User I/Os by Bank
Table 64
The AWAKE pin is counted as a dual-purpose I/O.
Table 64: User I/Os Per Bank for the XC3SD1800A in the CS484 Package
Table 65: User I/Os Per Bank for the XC3SD3400A in the CS484 Package
Footprint Migration Differences
There are no migration footprint differences between the XC3SD1800A and the XC3SD3400A in the CS484 package.
DS610 (v3.0) October 4, 2010
Product Specification
Notes:
1.
Notes:
1.
Top
Right
Bottom
Left
Top
Right
Bottom
Left
Package
Package
TOTAL
19 VREF are on INPUT pins.
TOTAL
19 VREF are on INPUT pins.
Edge
Edge
and
Table 65
I/O Bank
I/O Bank
0
1
2
3
0
1
2
3
indicates how the user-I/O pins are distributed between the four I/O banks on the CS484 package.
Maximum I/Os
Maximum I/O
Input-Only
Input-Only
and
and
309
309
77
78
76
78
77
78
76
78
156
156
I/O
I/O
49
23
33
51
49
23
33
51
www.xilinx.com
INPUT
INPUT
Spartan-3A DSP FPGA Family: Pinout Descriptions
13
13
41
13
13
41
9
6
9
6
All Possible I/O Pins by Type
All Possible I/O Pins by Type
DUAL
DUAL
30
21
52
30
21
52
1
0
1
0
VREF
VREF
28
28
6
8
8
6
6
8
8
6
(1)
(1)
CLK
CLK
32
32
8
8
8
8
8
8
8
8
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