XCV812E-6FG900C Xilinx Inc, XCV812E-6FG900C Datasheet - Page 117
![no-image](/images/no-image-200.jpg)
XCV812E-6FG900C
Manufacturer Part Number
XCV812E-6FG900C
Description
IC FPGA 1.8V C-TEMP 900-FBGA
Manufacturer
Xilinx Inc
Series
Virtex™-E EMr
Datasheet
1.XCV405E-6FG676C.pdf
(118 pages)
Specifications of XCV812E-6FG900C
Number Of Logic Elements/cells
21168
Number Of Labs/clbs
4704
Total Ram Bits
1146880
Number Of I /o
556
Number Of Gates
254016
Voltage - Supply
1.71 V ~ 1.89 V
Mounting Type
Surface Mount
Operating Temperature
0°C ~ 85°C
Package / Case
900-BBGA
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
XCV812E-6FG900C
Manufacturer:
Panasonic
Quantity:
140
Company:
Part Number:
XCV812E-6FG900C
Manufacturer:
XILINX
Quantity:
1 205
Part Number:
XCV812E-6FG900C
Manufacturer:
XILINX/赛灵思
Quantity:
20 000
Virtex-E Extended Memory Device/Package Combinations and Maximum I/O
Virtex-E Ordering Information
Virtex-II ordering information is shown in
DS025-4 (v1.6) July 17, 2002
Virtex-E Extended Memory Series Maximum User I/O by Device/Package (Excluding Dedicated Clock Pins)
R
Package
BG560
FG676
FG900
Example: XCV405E-6BG560C
Device Type
Speed Grade
(-6, -7, -8)
Figure 1
Figure 1: Virtex Ordering Information
Virtex™-E 1.8 V Extended Memory Field Programmable Gate Arrays
www.xilinx.com
1-800-255-7778
XCV405E
404
404
Temperature Range
C = Commercial (T
I = Industrial (T
Number of Pins
Package Type
BG = Ball Grid Array
FG = Fine Pitch Ball Grid Array
J
= −40˚C to +100˚C)
J
= 0˚C to +85˚C)
DS025_001_112000
XCV812E
404
556
Module 4 of 4
41