XC4062XL-2BG560I Xilinx Inc, XC4062XL-2BG560I Datasheet - Page 68
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XC4062XL-2BG560I
Manufacturer Part Number
XC4062XL-2BG560I
Description
IC FPGA I-TEMP 3.3V 2SPD 560MBGA
Manufacturer
Xilinx Inc
Series
XC4000E/Xr
Datasheet
1.XC4005E-4PC84C.pdf
(68 pages)
Specifications of XC4062XL-2BG560I
Number Of Logic Elements/cells
5472
Number Of Labs/clbs
2304
Total Ram Bits
73728
Number Of I /o
384
Number Of Gates
62000
Voltage - Supply
3 V ~ 3.6 V
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 100°C
Package / Case
560-LBGA, Metal
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
XC4000E and XC4000X Series Field Programmable Gate Arrays
XC4000 Series Electrical Characteristics and Device-Specific Pinout Table
For the latest Electrical Characteristics and package/pinout information for each XC4000 Family, see the Xilinx web site at
http://www.xilinx.com/xlnx/xweb/xil_publications_index.jsp
Ordering Information
Revision Control
6-72
3/30/98 (1.5) Updated XC4000XL timing and added XC4002XL
1/29/99 (1.5) Updated pin diagrams
5/14/99 (1.6) Replaced Electrical Specification and pinout pages for E, EX, and XL families with separate updates and
Version
Example:
added URL link for electrical specifications/pinouts for Web users
Speed Grade
Device Type
-6
-5
-4
-3
-2
-1
Product Obsolete or Under Obsolescence
PC = Plastic Lead Chip Carrier
PQ = Plastic Quad Flat Pack
VQ = Very Thin Quad Flat Pack
TQ = Thin Quad Flat Pack
XC4013E-3HQ240C
Package Type
BG = Ball Grid Array
PG = Ceramic Pin Grid Array
HQ = High Heat Dissipation Quad Flat Pack
MQ = Metal Quad Flat Pack
CB = Top Brazed Ceramic Quad Flat Pack
Description
Number of Pins
Temperature Range
C = Commercial (T
I = Industrial (T
M = Military (T
C
= -55 to+125 C)
J
= -40 to +100 C)
May 14, 1999 (Version 1.6)
J
= 0 to +85 C)
X9020
R