The Torpedo System on Module (SOM) is an ultra-compact
form factor based on Texas Instruments’ OMAP 3 processor
family.
The OMAP35x Torpedo SOM provides a dime-sized module
solution for applications that require low-power and high-
performance within tight space constraints. By using the 0.4 mm
BGA pitch OMAP processor that leverages Package-on-Package
(PoP) technology, the Torpedo SOM requires 45% less surface
area and 12% less volume when compared to the equivalent
OMAP 0.65 mm BGA package and external memory solution.
A discrete design using the 0.4 mm BGA package requires
advanced PCB technologies that result in higher board costs
in addition to PoP technology which requires specialized
manufacturing assembly processes. The Torpedo SOM solves
these development complexities; as a result, customers can
design lower cost baseboards and utilize common manufacturing
procedures while still benefiting from the small package OMAP35x
processor and PoP technology.
The ultra-compact Torpedo SOM is an ideal off-the-shelf solution
for applications in markets where space is a premium. From
PRODUCT BRIEF:
Logic PD :: Texas Instruments
www.logicpd.com/ti
OMAP35x Torpedo
:: SUPPORTED PROCESSORS:
OMAP3530
OMAP3503
System on Module
OMAP35x TORPEDO SYSTEM ON MODULE
point-of-care medical devices to bar code readers,
handheld radios to mobile Internet devices,
netbooks to CCTV cameras, the Torpedo SOM
allows for powerful versatility, compact designs,
and long-life products.
The Zoom™ OMAP35x Torpedo Development
Kit includes all of the necessary accessories to
immediately begin development, helping customers
deliver their products to market sooner.
OMAP35x TORPEDO SOM :: HIGHLIGHTS:
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ZOOM™ OMAP35x TORPEDO
DEVELOPMENT KIT :: FEATURES:
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Product-ready System on Module with a
Ultra-compact form factor
Long product lifecycle
Microsoft Windows® Embedded CE 6.0
Open source Linux
0˚C to 70˚C (commercial temp) or
RoHS compliant
Application baseboard
OMAP3530 Torpedo SOM
4.3” WQVGA LCD with 4-wire touchscreen
Necessary accessories to immediately
TI OMAP35x processor running up to 600 MHz
(15 x 27 x 3.8 mm)
Board Support Packages (BSPs)
-40˚C to 85˚C (industrial temp)
get up and running
™
BSP