PIC12F510-I/SN Microchip Technology, PIC12F510-I/SN Datasheet - Page 105

• Manufacturer Part Number: PIC12F510-I/SN
• Description: IC PIC MCU FLASH 1KX14 8SOIC
• Manufacturer: Microchip Technology
• Series: PIC® 12Fr

Specifications of PIC12F510-I/SN

• Program Memory Type: FLASH
• Program Memory Size: 1.5KB (1K x 12)
• Package / Case: 8-SOIC (3.9mm Width)
• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 8MHz
• Peripherals: POR, WDT
• Number Of I /o: 5
• Ram Size: 38 x 8
• Voltage - Supply (vcc/vdd): 2 V ~ 5.5 V
• Data Converters: A/D 4x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: PIC12F
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 38 B
• Maximum Clock Frequency: 8 MHz
• Number Of Programmable I/os: 5
• Number Of Timers: 1
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, DV164101, DV164120, DM163029
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 8 bit, 3 Channel
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: AC162070 - HEADER INTRFC MPLAB ICD2 8/14P
• Eeprom Size: -
• Connectivity: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

8-Lead Plastic Small Outline (SN) – Narrow, 3.90 mm Body [SOIC]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
© 2007 Microchip Technology Inc.
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff
Overall Width
Molded Package Width
Overall Length
Chamfer (optional)
Foot Length
Footprint
Foot Angle
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
NOTE 1
A
A1
§
N
1
2
D
b
3
e
Dimension Limits
Preliminary
A2
E1
E
Units
φ
A2
A1
E1
L1
N
D
A
E
α
e
h
L
φ
c
b
β
MIN
1.25
0.10
0.25
0.40
0.17
0.31
L1
0°
5°
5°
h
L
–
PIC12F510/16F506
MILLIMETERS
h
1.27 BSC
6.00 BSC
3.90 BSC
4.90 BSC
1.04 REF
NOM
8
–
–
–
–
–
–
–
–
–
–
Microchip Technology Drawing C04-057B
α
β
MAX
1.75
0.25
0.50
1.27
0.25
0.51
15°
15°
8°
–
c
DS41268C-page 103