MPC8271CVRTIEA Freescale Semiconductor, MPC8271CVRTIEA Datasheet - Page 15
![IC MPU POWERQUICC II 516-PBGA](/photos/6/76/67695/mpc8271cvrtiea_sml.jpg)
MPC8271CVRTIEA
Manufacturer Part Number
MPC8271CVRTIEA
Description
IC MPU POWERQUICC II 516-PBGA
Manufacturer
Freescale Semiconductor
Datasheet
1.MPC8248VRMIBA.pdf
(60 pages)
Specifications of MPC8271CVRTIEA
Processor Type
MPC82xx PowerQUICC II 32-bit
Speed
400MHz
Voltage
1.5V
Mounting Type
Surface Mount
Package / Case
516-PBGA
Processor Series
MPC8xxx
Core
603e
Data Bus Width
32 bit
Maximum Clock Frequency
400 MHz
Operating Supply Voltage
1.4 V to 1.6 V
Maximum Operating Temperature
+ 105 C
Mounting Style
SMD/SMT
Data Ram Size
4 KB
Minimum Operating Temperature
- 40 C
Number Of Programmable I/os
14
Program Memory Size
16 KB
Program Memory Type
EEPROM
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Features
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MPC8271CVRTIEA
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Part Number:
MPC8271CVRTIEA
Manufacturer:
XILINX/赛灵思
Quantity:
20 000
Company:
Part Number:
MPC8271CVRTIEA400/200/100
Manufacturer:
FREESCAL
Quantity:
200
5
Table 7
thermal management is required to ensure the junction temperature does not exceed the maximum
specified value. Also note that the I/O power should be included when determining whether to use a heat
sink. For a complete list of possible clock configurations, refer to
Modes.”
Freescale Semiconductor
JEDEC Specifications
1. C.E. Triplett and B. Joiner, “An Experimental Characterization of a 272 PBGA Within an
2. B. Joiner and V. Adams, “Measurement and Simulation of Junction to Board Thermal Resistance
1
2
3
66.7 MHz = 0.35 W (nominal), 0.4 W (maximum)
83.3 MHz = 0.4 W (nominal), 0.5 W (maximum)
100 MHz = 0.5 W (nominal), 0.6 W (maximum)
133 MHz = 0.7 W (nominal), 0.8 W (maximum)
Test temperature = 105
P
Values do not include I/O. Add the following estimates for active I/O based on the following bus speeds:
Automotive Engine Controller Module,” Proceedings of SemiTherm, San Diego, 1998, pp. 47–54.
and Its Application in Thermal Modeling,” Proceedings of SemiTherm, San Diego, 1999, pp.
212–220.
Power Dissipation
INT
provides preliminary, estimated power dissipation for various configurations. Note that suitable
= I
(MHz)
66.67
Bus
100
100
133
DD
x V
DD
Table 7. Estimated Power Dissipation for Various Configurations
Watts
MPC8272 PowerQUICC II™ Family Hardware Specifications, Rev. 2
Multiplication
°
C
Factor
CPM
3
2
2
2
(MHz)
CPM
200
200
200
267
Multiplication
Factor
CPU
4
3
4
3
Section 7, “Clock Configuration
(MHz)
CPU
266
300
400
400
http://www.jedec.org
Nominal
1.1
1.3
1.5
1
Vddl 1.5 Volts
1
P
INT
(W)
Power Dissipation
Maximum
2, 3
1.2
1.3
1.5
1.8
15