MPC860TCVR66D4 Freescale Semiconductor, MPC860TCVR66D4 Datasheet - Page 13

• Manufacturer Part Number: MPC860TCVR66D4
• Description: IC MPU POWERQUICC 66MHZ 357PBGA
• Manufacturer: Freescale Semiconductor
• Series: PowerQUICCr

Specifications of MPC860TCVR66D4

• Processor Type: MPC8xx PowerQUICC 32-Bit
• Speed: 66MHz
• Voltage: 3.3V
• Mounting Type: Surface Mount
• Package / Case: 357-PBGA
• Core Size: 32 Bit
• Program Memory Size: 8KB
• Cpu Speed: 66MHz
• Digital Ic Case Style: BGA
• No. Of Pins: 357
• Supply Voltage Range: 2V To 3.6V
• Operating Temperature Range: -40°C To +95°C
• Rohs Compliant: Yes
• Family Name: MPC8xx
• Device Core: PowerQUICC
• Device Core Size: 32b
• Frequency (max): 66MHz
• Instruction Set Architecture: RISC
• Supply Voltage 1 (typ): 2.5/3.3V
• Operating Supply Voltage (max): 3.465/3.6V
• Operating Supply Voltage (min): 2/3.135V
• Operating Temp Range: -40C to 95C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 357
• Package Type: BGA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Features: -
• Lead Free Status / Rohs Status: Compliant

If the board temperature is known, an estimate of the junction temperature in the environment can be made
using the following equation:
where:
If the board temperature is known and the heat loss from the package case to the air can be ignored,
acceptable predictions of junction temperature can be made. For this method to work, the board and board
mounting must be similar to the test board used to determine the junction-to-board thermal resistance,
namely a 2s2p (board with a power and a ground plane) and by attaching the thermal balls to the ground
plane.
7.4
When the board temperature is not known, a thermal simulation of the application is needed. The simple
two-resistor model can be used with the thermal simulation of the application [2], or a more accurate and
complex model of the package can be used in the thermal simulation.
7.5
To determine the junction temperature of the device in the application after prototypes are available, the
thermal characterization parameter (Ψ
measurement of the temperature at the top center of the package case using the following equation:
Freescale Semiconductor
R
T
P
D
B
θJB
Estimation Using Simulation
Experimental Determination
= board temperature (ºC)
= power dissipation in package
= junction-to-board thermal resistance (ºC/W)
T
T
J
J
= T
= T
Figure 2. Effect of Board Temperature Rise on Thermal Behavior
B
T
+ (Ψ
+ (R
MPC860 PowerQUICC™ Family Hardware Specifications, Rev. 8
θJB
JT
× P
× P
Board Temperature Rise Above Ambient Divided by Package Power
D
D
)
)
JT
) can be used to determine the junction temperature with a
Thermal Calculation and Measurement
13