MPC852TZT50A Freescale Semiconductor, MPC852TZT50A Datasheet - Page 75

• Manufacturer Part Number: MPC852TZT50A
• Description: IC MPU POWERQUICC 50MHZ 256PBGA
• Manufacturer: Freescale Semiconductor
• Series: PowerQUICC Ir

Specifications of MPC852TZT50A

• Processor Type: MPC8xx PowerQUICC 32-Bit
• Speed: 50MHz
• Voltage: 1.8V
• Mounting Type: Surface Mount
• Package / Case: 256-PBGA
• Processor Series: MPC8xx
• Core: MPC8xx
• Data Bus Width: 32 bit
• Development Tools By Supplier: MPC852TADS-KIT
• Maximum Clock Frequency: 50 MHz
• Operating Supply Voltage: 1.8 V, 3.3 V
• Maximum Operating Temperature: + 105 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: 0 C
• Core Size: 32 Bit
• Program Memory Size: 8KB
• Cpu Speed: 50MHz
• Embedded Interface Type: SPI
• Digital Ic Case Style: BGA
• No. Of Pins: 256
• Rohs Compliant: No
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Features: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

16.2
For more information on the printed-circuit board layout of the PBGA package, including thermal via
design and suggested pad layout, refer to Plastic Ball Grid Array Application Note (order number:
AN1231) that is available from your local Freescale sales office.
dimensions of the PBGA package.
Freescale Semiconductor
Figure 65. Mechanical Dimensions and Bottom Surface Nomenclature of the PBGA Package
Mechanical Dimensions of the PBGA Package
Notes:
Note: Solder sphere composition is 95.5%Sn 45%Ag 0.5%Cu for MPC852TVRXXX.
1. All dimensions are in millimeters.
2. Interpret dimensions and tolerances per ASME Y14.5M—1994.
3. Maximum solder ball diameter measured parallel to datum A.
4. Datum A, the seating plane, is defined by the spherical crowns of the solder balls.
Solder sphere composition is 62%Sn 36%Pb 2%Ag for MPC852TZTXXX.
MPC852T PowerQUICC™ Hardware Specifications, Rev. 4
Figure 65
Mechanical Data and Ordering Information
shows the mechanical
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