MPC8347VVAGDB Freescale Semiconductor, MPC8347VVAGDB Datasheet - Page 10

• Manufacturer Part Number: MPC8347VVAGDB
• Description: IC MPU POWERQUICC II 672-PBGA
• Manufacturer: Freescale Semiconductor
• Series: PowerQUICC II PROr

Specifications of MPC8347VVAGDB

• Processor Type: MPC83xx PowerQUICC II Pro 32-Bit
• Speed: 400MHz
• Voltage: 1.2V
• Mounting Type: Surface Mount
• Package / Case: 620-PBGA
• Processor Series: MPC8xxx
• Core: e300
• Data Bus Width: 32 bit
• Development Tools By Supplier: MPC8349E-MITXE
• Maximum Clock Frequency: 400 MHz
• Maximum Operating Temperature: + 105 C
• Mounting Style: SMD/SMT
• I/o Voltage: 1.8 V, 2.5 V, 3.3 V
• Minimum Operating Temperature: 0 C
• Family Name: MPC83xx
• Device Core: PowerQUICC II Pro
• Device Core Size: 32b
• Frequency (max): 400MHz
• Instruction Set Architecture: RISC
• Supply Voltage 1 (typ): 1.2V
• Operating Supply Voltage (max): 1.26V
• Operating Supply Voltage (min): 1.14V
• Operating Temp Range: 0C to 105C
• Operating Temperature Classification: Commercial
• Mounting: Surface Mount
• Pin Count: 672
• Package Type: TBGA
• Core Size: 32 Bit
• Program Memory Size: 64KB
• Cpu Speed: 400MHz
• Embedded Interface Type: I2C, SPI, USB, UART
• Digital Ic Case Style: TBGA
• No. Of Pins: 672
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Features: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

Power Characteristics
3
The estimated typical power dissipation for the MPC8347E device is shown in
1
2
3
4
10
The values do not include I/O supply power (OV
Typical power is based on a voltage of V
application.
Thermal solutions may need to design to a value higher than typical power based on the end application, T
power.
Maximum power is based on a voltage of V
artificial smoke test.
Power Characteristics
PBGA
TBGA
MPC8347E PowerQUICC™ II Pro Integrated Host Processor Hardware Specifications, Rev. 11
Frequency
(MHz)
Core
266
400
400
333
400
450
500
533
Table 4. MPC8347E Power Dissipation
DD
DD
= 1.2 V, a junction temperature of T
= 1.2 V, worst case process, a junction temperature of T
DD
Frequency
, LV
(MHz)
CSB
266
133
266
133
200
100
333
166
266
133
300
150
333
166
266
133
DD
, GV
DD
) or AV
Typical at T
DD
1.3
1.1
1.5
1.4
1.5
1.3
2.0
1.8
2.1
1.9
2.3
2.1
2.4
2.2
2.4
2.2
. For I/O power values, see
J
= 65
J
= 105°C, and a Dhrystone benchmark
1
Typical
1.6
1.4
1.9
1.7
1.8
1.7
3.0
2.8
3.0
2.9
3.2
3.0
3.3
3.1
3.3
3.1
Table
2
,
3
Freescale Semiconductor
Maximum
Table
4.
J
= 105°C, and an
1.8
1.6
2.1
1.9
2.0
1.9
3.2
2.9
3.3
3.1
3.5
3.2
3.6
3.4
3.6
3.4
A
5.
target, and I/O
4
Unit
W
W
W
W
W
W
W
W
W
W
W
W
W
W
W
W