MPC8260AZUMHBB Freescale Semiconductor, MPC8260AZUMHBB Datasheet - Page 37
MPC8260AZUMHBB
Manufacturer Part Number
MPC8260AZUMHBB
Description
IC MPU POWERQUICC II 480-TBGA
Manufacturer
Freescale Semiconductor
Specifications of MPC8260AZUMHBB
Processor Type
MPC82xx PowerQUICC II 32-bit
Speed
266MHz
Voltage
2V
Mounting Type
Surface Mount
Package / Case
480-TBGA
Processor Series
MPC8xxx
Core
603e
Data Bus Width
32 bit
Maximum Clock Frequency
266 MHz
Maximum Operating Temperature
+ 105 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
0 C
Leaded Process Compatible
Yes
Peak Reflow Compatible (260 C)
No
Rohs Compliant
No
For Use With
MPC8260ADS-TCOM - BOARD DEV ADS POWERQUICC II
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Features
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MPC8260AZUMHBB
Manufacturer:
MOTOROLA
Quantity:
490
Company:
Part Number:
MPC8260AZUMHBB
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Part Number:
MPC8260AZUMHBB
Manufacturer:
FREE
Quantity:
20 000
5
The following sections provide the package parameters and mechanical dimensions for the MPC8260.
5.1
Package parameters are provided in
Freescale Semiconductor
UTS
UT8
UT16
MII
Package Description
MPC8260 PowerQUICC II Integrated Communications Processor Hardware Specifications, Rev. 2
Package Parameters
Symbol
Package Outline
Interconnects
Pitch
Nominal unmounted package height 1.55 mm
Table 15. Symbol Legend (continued)
Parameter
Table
Table 16. Package Parameters
16. The package type is a 37.5 × 37.5 mm, 480-lead TBGA.
Indicates that a signal is part of the UTOPIA slave interface
Indicates that a signal is part of the 8-bit UTOPIA interface
Indicates that a signal is part of the 16-bit UTOPIA interface
Indicates that a signal is part of the media independent interface
37.5 x 37.5 mm
480 (29 x 29 ball array)
1.27 mm
Value
Meaning
Package Description
37