MPC870CZT66 Freescale Semiconductor, MPC870CZT66 Datasheet - Page 79

• Manufacturer Part Number: MPC870CZT66
• Description: IC MPU POWERQUICC 66MHZ 256PBGA
• Manufacturer: Freescale Semiconductor

Specifications of MPC870CZT66

• Processor Type: MPC8xx PowerQUICC 32-Bit
• Speed: 66MHz
• Voltage: 3.3V
• Mounting Type: Surface Mount
• Package / Case: 256-PBGA
• Family Name: MPC8xx
• Device Core: PowerQUICC
• Device Core Size: 32b
• Frequency (max): 66MHz
• Instruction Set Architecture: RISC
• Supply Voltage 1 (typ): 1.8V
• Operating Supply Voltage (max): 1.9V
• Operating Supply Voltage (min): 1.7V
• Operating Temp Range: -40C to 100C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 256
• Package Type: BGA
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Features: -
• Lead Free Status / Rohs Status: Not Compliant

16.2
Figure 70
Freescale Semiconductor
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Figure 70. Mechanical Dimensions and Bottom Surface Nomenclature of the PBGA Package
1. ALL DIMENSIONS ARE IN MILLIMETERS.
2. INTERPRET DIMENSIONS AND TOLERANCES PER ASME Y14.5M—1994.
3. MAXIMUM SOLDER BALL DIAMETER MEASURED PARALLEL TO DATUM A.
4. DATUM A, THE SEATING PLANE, IS DEFINED BY THE SPHERICAL CROWNS OF THE SOLDER BALLS.
Note:
NOTES:
Mechanical Dimensions of the PBGA Package
shows the mechanical dimensions of the PBGA package.
Solder sphere composition is 95.5%Sn 45%Ag 0.5%Cu for MPC875/MPC870VRXXX.
Solder sphere composition is 62%Sn 36%Pb 2%Ag for MPC875/MPC870ZTXXX.
MPC875/MPC870 PowerQUICC™ Hardware Specifications, Rev. 4
Mechanical Data and Ordering Information
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