MPC875ZT133 Freescale Semiconductor, MPC875ZT133 Datasheet - Page 79
MPC875ZT133
Manufacturer Part Number
MPC875ZT133
Description
IC MPU POWERQUICC 133MHZ 256PBGA
Manufacturer
Freescale Semiconductor
Datasheet
1.MPC870VR80.pdf
(84 pages)
Specifications of MPC875ZT133
Processor Type
MPC8xx PowerQUICC 32-Bit
Speed
133MHz
Voltage
3.3V
Mounting Type
Surface Mount
Package / Case
256-PBGA
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Features
-
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MPC875ZT133
Manufacturer:
MOT
Quantity:
1 831
Company:
Part Number:
MPC875ZT133
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
16.2
Figure 70
Freescale Semiconductor
.
Figure 70. Mechanical Dimensions and Bottom Surface Nomenclature of the PBGA Package
1. ALL DIMENSIONS ARE IN MILLIMETERS.
2. INTERPRET DIMENSIONS AND TOLERANCES PER ASME Y14.5M—1994.
3. MAXIMUM SOLDER BALL DIAMETER MEASURED PARALLEL TO DATUM A.
4. DATUM A, THE SEATING PLANE, IS DEFINED BY THE SPHERICAL CROWNS OF THE SOLDER BALLS.
Note:
NOTES:
Mechanical Dimensions of the PBGA Package
shows the mechanical dimensions of the PBGA package.
Solder sphere composition is 95.5%Sn 45%Ag 0.5%Cu for MPC875/MPC870VRXXX.
Solder sphere composition is 62%Sn 36%Pb 2%Ag for MPC875/MPC870ZTXXX.
MPC875/MPC870 PowerQUICC™ Hardware Specifications, Rev. 4
Mechanical Data and Ordering Information
79