MPC850DEZQ50BU Freescale Semiconductor, MPC850DEZQ50BU Datasheet - Page 9

no-image

MPC850DEZQ50BU

Manufacturer Part Number
MPC850DEZQ50BU
Description
IC MPU PWRQUICC 50MHZ 256-PBGA
Manufacturer
Freescale Semiconductor
Datasheet

Specifications of MPC850DEZQ50BU

Processor Type
MPC8xx PowerQUICC 32-Bit
Speed
50MHz
Voltage
3.3V
Mounting Type
Surface Mount
Package / Case
256-PBGA
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Features
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MPC850DEZQ50BU
Manufacturer:
SEMTECH
Quantity:
8 390
Part Number:
MPC850DEZQ50BU
Manufacturer:
FREESCAL
Quantity:
300
Part Number:
MPC850DEZQ50BU
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Part Number:
MPC850DEZQ50BU
Manufacturer:
FREESCALE
Quantity:
8 000
Part Number:
MPC850DEZQ50BU
Manufacturer:
FREESCALE
Quantity:
20 000
Part Number:
MPC850DEZQ50BUR2
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
5
The average chip-junction temperature
T
where
T
Freescale Semiconductor
A
J
= T
= Ambient temperature
1
2
3 The MPC850 IBIS model must be used to accurately model the behavior of the Clkout output driver for the full and
Input low voltage
EXTAL, EXTCLK input high voltage
Input leakage current, Vin = 5.5 V (Except TMS, TRST, DSCK
and DSDI pins)
Input leakage current, Vin = 3.6V (Except TMS, TRST, DSCK
and DSDI pins)
Input leakage current, Vin = 0V (Except TMS, TRST, DSCK
and DSDI pins)
Input capacitance
Output high voltage, IOH = -2.0 mA, VDDH = 3.0V
except XTAL, XFC, and open-drain pins
Output low voltage
CLKOUT
IOL = 3.2 mA
IOL = 5.3 mA
IOL = 7.0 mA PA[14]/USBOE, PA[12]/TXD2
IOL = 8.9 mA TS, TA, TEA, BI, BB, HRESET, SRESET
IP_B2/IOIS16_B/AT2, IP_B3/IWP2/VF2, IP_B4/LWP0/VF0, IP_B5/LWP1/VF1, IP_B6/DSDI/AT0, IP_B7/PTR/AT3,
PA[15]/USBRXD, PA[13]/RXD2, PA[9]/L1TXDA/SMRXD2, PA[8]/L1RXDA/SMTXD2,
PA[7]/CLK1/TIN1/L1RCLKA/BRGO1, PA[6]/CLK2/TOUT1/TIN3, PA[5]/CLK3/TIN2/L1TCLKA/BRGO2,
PA[4]/CLK4/TOUT2/TIN4, PB[31]/SPISEL, PB[30]/SPICLK/TXD3, PB[29]/SPIMOSI /RXD3,
PB[28]/SPIMISO/BRGO3, PB[27]/I2CSDA/BRGO1, PB[26]/I2CSCL/BRGO2, PB[25]/SMTXD1/TXD3,
PB[24]/SMRXD1/RXD3, PB[23]/SMSYN1/SDACK1, PB[22]/SMSYN2/SDACK2, PB[19]/L1ST1,
PB[18]/RTS2/L1ST2, PB[17]/L1ST3, PB[16]/L1RQa/L1ST4, PC[15]/DREQ0/L1ST5, PC[14]/DREQ1/RTS2/L1ST6,
PC[13]/L1ST7/RTS3, PC[12]/L1RQa/L1ST8, PC[11]/USBRXP, PC[10]/TGATE1/USBRXN, PC[9]/CTS2,
PC[8]/CD2/TGATE1, PC[7]/USBTXP, PC[6]/USBTXN, PC[5]/CTS3/L1TSYNCA/SDACK1, PC[4]/CD3/L1RSYNCA,
PD[15], PD[14], PD[13], PD[12], PD[11], PD[10], PD[9], PD[8], PD[7], PD[6], PD[5], PD[4], PD[3]
WE2/BS_AB2/PCOE, WE3/BS_AB3/PCWE, GPL_A0/GPL_B0, OE/GPL_A1/GPL_B1,
GPL_A[2:3]/GPL_B[2:3]/CS[2:3], UPWAITA/GPL_A4/AS, UPWAITB/GPL_B4, GPL_A5, ALE_B/DSCK/AT1,
OP2/MODCK1/STS, OP3/MODCK2/DSDO
half drive setting. Due to the nature of the Clkout output buffer, IOH and IOL for Clkout should be extracted from the
IBIS model at any output voltage level.
A[6:31], TSIZ0/REG, TSIZ1, D[0:31], DP[0:3]/IRQ[3:6], RD/WR, BURST, RSV/IRQ2, IP_B[0:1]/IWP[0:1]/VFLS[0:1],
BDIP/GPL_B5, BR, BG, FRZ/IRQ6, CS[0:5], CS6/CE1_B, CS7/CE2_B, WE0/BS_AB0/IORD, WE1/BS_AB1/IOWR,
A
Power Considerations
+ (P
MPC850 PowerQUICC™ Integrated Communications Processor Hardware Specifications, Rev. 2
3
D
1
2
θ
JA
)(1)
Characteristic
,
°C
Table 5. DC Electrical Specifications (continued)
,
T
J
,
in °C can be obtained from the equation:
Symbol
VIHC
VOH
VOL
VIL
C
I
I
I
In
In
in
in
0.7*(VCC)
GND
Min
2.4
VCC+0.3
Power Considerations
Max
100
0.8
0.5
10
10
20
Unit
µA
µA
µA
pF
V
V
V
V
9

Related parts for MPC850DEZQ50BU