MPC8541EPXAQF Freescale Semiconductor, MPC8541EPXAQF Datasheet - Page 72
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MPC8541EPXAQF
Manufacturer Part Number
MPC8541EPXAQF
Description
IC MPU POWERQUICC III 783-FCPBGA
Manufacturer
Freescale Semiconductor
Series
PowerQUICC IIIr
Specifications of MPC8541EPXAQF
Processor Type
MPC85xx PowerQUICC III 32-Bit
Speed
1.0GHz
Voltage
1.3V
Mounting Type
Surface Mount
Package / Case
783-FCPBGA
Core Size
32 Bit
Program Memory Size
64KB
Cpu Speed
1GHz
Embedded Interface Type
I2C, SPI, UART
Digital Ic Case Style
BGA
No. Of Pins
783
Rohs Compliant
No
For Use With
MPC8548CDS - DEV TOOLS CDS FOR 8548CWH-PPC-8540N-VE - KIT EVAL SYSTEM MPC8540
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Features
-
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MPC8541EPXAQF
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Thermal
16.2.4
The following section provides a heat sink selection example using one of the commercially available heat
sinks.
16.2.4.1
For preliminary heat sink sizing, the die-junction temperature can be expressed as follows:
where
During operation the die-junction temperatures (T
Table
and the air temperature rise within the electronic cabinet. An electronic cabinet inlet-air temperature (T
may range from 30° to 40°C. The air temperature rise within a cabinet (T
10°C. The thermal resistance of some thermal interface material (θ
purposes of this example, the θ
documented in note 4 is used. If a thermal pad is used, θ
Assuming a T
8.0 W, the following expression for T
The heat sink-to-ambient thermal resistance (θ
#2328B is shown in
Assuming an air velocity of 2 m/s, we have an effective θ
resulting in a die-junction temperature of approximately 69°C which is well within the maximum
operating temperature of the component.
72
2. The temperature of air cooling the component greatly depends on the ambient inlet air temperature
Chanhassen, MN 55317
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Thermagon Inc.
4707 Detroit Ave.
Cleveland, OH 44102
Internet: www.thermagon.com
T
T
T
θ
θ
θ
P
MPC8541E PowerQUICC™ III Integrated Communications Processor Hardware Specification, Rev. 4.2
JC
INT
SA
D
J
I
R
is the die-junction temperature
is the inlet cabinet ambient temperature
is the power dissipated by the device. See
is the air temperature rise within the computer cabinet
Die-junction temperature: T
is the junction-to-case thermal resistance
is the heat sink base-to-ambient thermal resistance
Heat Sink Selection Examples
is the adhesive or interface material thermal resistance
Case 1
I
T
T
of 30°C, a T
J
J
= T
= 30°C + 5°C + (0.96°C/W + 3.3°C/W) × 8.0 W,
Figure
I
+ T
R
+ (θ
R
46.
of 5°C, a FC-PBGA package θ
JC
JC
value given in
+ θ
J
INT
is obtained:
J
= 30°C + 5°C + (0.96°C/W + θ
+ θ
SA
SA
) × P
Table 49
) versus airflow velocity for a Thermalloy heat sink
J
) should be maintained within the range specified in
D
Table 4
INT
that includes the thermal grease interface and is
SA+
888-246-9050
must be added.
JC
and
of about 3.3°C/W, thus
= 0.96, and a power consumption (P
Table
INT
) may be about 1°C/W. For the
5.
SA
R
) may be in the range of 5° to
) × 8.0 W
Freescale Semiconductor
D
) of
A
)