XPC8255CZUIFBC Freescale Semiconductor, XPC8255CZUIFBC Datasheet - Page 37

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XPC8255CZUIFBC

Manufacturer Part Number
XPC8255CZUIFBC
Description
IC MPU POWERQUICC II 480-TBGA
Manufacturer
Freescale Semiconductor
Datasheet

Specifications of XPC8255CZUIFBC

Processor Type
MPC82xx PowerQUICC II 32-bit
Speed
200MHz
Voltage
2.5V
Mounting Type
Surface Mount
Package / Case
480-TBGA
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Features
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
XPC8255CZUIFBC
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
5
The following sections provide the package parameters and mechanical dimensions for the MPC8260.
5.1
Package parameters are provided in
Freescale Semiconductor
UTS
UT8
UT16
MII
Package Description
MPC8260 PowerQUICC II Integrated Communications Processor Hardware Specifications, Rev. 2
Package Parameters
Symbol
Package Outline
Interconnects
Pitch
Nominal unmounted package height 1.55 mm
Table 15. Symbol Legend (continued)
Parameter
Table
Table 16. Package Parameters
16. The package type is a 37.5 × 37.5 mm, 480-lead TBGA.
Indicates that a signal is part of the UTOPIA slave interface
Indicates that a signal is part of the 8-bit UTOPIA interface
Indicates that a signal is part of the 16-bit UTOPIA interface
Indicates that a signal is part of the media independent interface
37.5 x 37.5 mm
480 (29 x 29 ball array)
1.27 mm
Value
Meaning
Package Description
37

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