XPC8260CZUHFBC Freescale Semiconductor, XPC8260CZUHFBC Datasheet - Page 38

IC MPU POWERQUICC II 480-TBGA

XPC8260CZUHFBC

Manufacturer Part Number
XPC8260CZUHFBC
Description
IC MPU POWERQUICC II 480-TBGA
Manufacturer
Freescale Semiconductor
Series
PowerQUICC IIr
Datasheets

Specifications of XPC8260CZUHFBC

Processor Type
MPC82xx PowerQUICC II 32-bit
Speed
166MHz
Voltage
2.5V
Mounting Type
Surface Mount
Package / Case
480-TBGA
Core Size
32 Bit
Program Memory Size
32KB
Cpu Speed
133MHz
Embedded Interface Type
I2C, MII, SPI, TDM, UTOPIA
Digital Ic Case Style
TBGA
No. Of Pins
480
Rohs Compliant
No
Family Name
MPC82XX
Device Core
PowerQUICC II
Device Core Size
32b
Frequency (max)
166MHz
Instruction Set Architecture
RISC
Supply Voltage 1 (typ)
1.8V
Operating Supply Voltage (max)
1.9V
Operating Supply Voltage (min)
1.7V
Operating Temp Range
-40C to 105C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
480
Package Type
TBGA
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Features
-
Lead Free Status / Rohs Status
Not Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
XPC8260CZUHFBC
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Package Description
5.2
Figure 15
package.
38
MPC8260 PowerQUICC II Integrated Communications Processor Hardware Specifications, Rev. 2
Mechanical Dimensions
provides the mechanical dimensions and bottom surface nomenclature of the 480 TBGA
Figure 15. Mechanical Dimensions and Bottom Surface Nomenclature
Notes:
1. Dimensions and Tolerancing per
ASME Y14.5M-1994.
2. Dimensions in millimeters.
3. Dimension b is measured at the
maximum solder ball diameter, parallel
to primary data A.
Dim
D1
A1
A2
A3
E1
A
D
E
b
e
Freescale Semiconductor
Millimeters
Min
1.45
0.60
0.85
0.25
0.65
37.50 BSC
35.56 REF
37.50 BSC
35.56 REF
1.27 BSC
Max
1.65
0.70
0.95
0.85

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