MC7457RX1000LC Freescale Semiconductor, MC7457RX1000LC Datasheet - Page 60

• Manufacturer Part Number: MC7457RX1000LC
• Description: IC MPU RISC 32BIT 483FCCBGA
• Manufacturer: Freescale Semiconductor

Specifications of MC7457RX1000LC

• Processor Type: MPC74xx PowerPC 32-Bit
• Speed: 1.0GHz
• Voltage: 1.3V
• Mounting Type: Surface Mount
• Package / Case: 483-FCCBGA
• Family Name: MPC74xx
• Device Core: PowerPC
• Device Core Size: 32b
• Frequency (max): 1GHz
• Instruction Set Architecture: RISC
• Supply Voltage 1 (typ): 1.3/1.5/1.8/2.5V
• Operating Supply Voltage (max): 1.35/1.575/2.625V
• Operating Supply Voltage (min): 1.25/1.425/1.71V
• Operating Temp Range: 0C to 105C
• Operating Temperature Classification: Commercial
• Mounting: Surface Mount
• Pin Count: 483
• Package Type: FCCBGA
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Features: -
• Lead Free Status / Rohs Status: Not Compliant

System Design Information
Ultimately, the final selection of an appropriate heat sink depends on many factors, such as thermal
performance at a given air velocity, spatial volume, mass, attachment method, assembly, and cost.
9.8.1
For the exposed-die packaging technology, shown in
paths are as follows:
Figure 28
printed-circuit board.
Heat generated on the active side of the chip is conducted through the silicon, through the heat sink attach
material (or thermal interface material), and finally to the heat sink where it is removed by forced-air
convection.
Because the silicon thermal resistance is quite small, for a first-order analysis, the temperature drop in the
silicon may be neglected. Thus, the thermal interface material and the heat sink conduction/convective
thermal resistances are the dominant terms.
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Tyco Electronics
Chip Coolers™
P.O. Box 3668
Harrisburg, PA 17105-3668
Internet: www.chipcoolers.com
Wakefield Engineering
33 Bridge St.
Pelham, NH 03076
Internet: www.wakefield.com
The die junction-to-case (actually top-of-die since silicon die is exposed) thermal resistance
The die junction-to-ball thermal resistance
depicts the primary heat transfer path for a package with an attached heat sink mounted to a
Internal Package Conduction Resistance
(Note the internal versus external package resistance.)
Figure 28. C4 Package with Heat Sink Mounted to a Printed-Circuit Board
External Resistance
External Resistance
Internal Resistance
MPC7457 RISC Microprocessor Hardware Specifications, Rev. 7
Printed-Circuit Board
Heat Sink
Radiation
Radiation
Table
Convection
Convection
5, the intrinsic conduction thermal resistance
800-522-6752
603-635-5102
Thermal Interface Material
Die/Package
Die Junction
Package/Leads
Freescale Semiconductor