XPC8260CZUIHBC Freescale Semiconductor, XPC8260CZUIHBC Datasheet - Page 10
![IC MPU POWERQUICC II 480-TBGA](/photos/39/61/396118/4533892_sml.jpg)
XPC8260CZUIHBC
Manufacturer Part Number
XPC8260CZUIHBC
Description
IC MPU POWERQUICC II 480-TBGA
Manufacturer
Freescale Semiconductor
Series
PowerQUICC IIr
Datasheet
1.MPC8260AZUPIBB.pdf
(41 pages)
Specifications of XPC8260CZUIHBC
Processor Type
MPC82xx PowerQUICC II 32-bit
Speed
200MHz
Voltage
2.5V
Mounting Type
Surface Mount
Package / Case
480-TBGA
Core Size
32 Bit
Program Memory Size
32KB
Cpu Speed
166MHz
Embedded Interface Type
I2C, MII, SPI, TDM, UTOPIA
Digital Ic Case Style
TBGA
No. Of Pins
480
Rohs Compliant
No
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Features
-
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
XPC8260CZUIHBC
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Part Number:
XPC8260CZUIHBC
Manufacturer:
FREESCALE
Quantity:
20 000
3
Electrical and Thermal Characteristics
2.2
Table 4
2.3
The average chip-junction temperature
where
For most applications P
T
Solving equations (1) and (2) for K gives:
where K is a constant pertaining to the particular part. K can be determined from equation (3) by measuring
P
solving equations (1) and (2) iteratively for any value of T
10
D
J
Rev C.2 silicon only.
is the following:
(at equilibrium) for a known T
T
T
θ
P
P
P
P
K = P
describes thermal characteristics.
A
D
INT
I/O
D
JA
J
MPC8260 PowerQUICC II Integrated Communications Processor Hardware Specifications, Rev. 2
Thermal Characteristics
Power Considerations
= T
= ambient temperature °C
= P
= K/(T
= package thermal resistance
= power dissipation on input and output pins (determined by user)
= I
D
A
INT
DD
x (T
+ (P
1
2
3
Thermal resistance for TBGA
Note:
J
Assumes a single layer board with no thermal vias
Natural convection
Assumes a four layer board
+ P
x V
+ 273° C)
A
D
+ 273° C) +
I/O
x
DD
Characteristics
θ
I/O
JA
Watts (chip internal power)
)
< 0.3 x P
θ
JA
A
. Using this value of K
x P
INT
Table 4. Thermal Characteristics
,
junction to ambient
,
D
. If P
T
2
J
,
in °C can be obtained from the following:
I/O
Symbol
is neglected
θ
θ
θ
θ
JA
JA
JA
JA
,
°C/W
,
A
13.07
10.48
Value
9.55
7.78
the values of P
,
.
an approximate relationship between P
1
3
1
3
°C/W
°C/W
°C/W
°C/W
Unit
D
and T
Air Flow
J
1 m/s
1 m/s
NC
NC
can be obtained by
Freescale Semiconductor
2
(2)
(1)
(3)
D
and