PMJ5918TSR Ericsson Power Modules, PMJ5918TSR Datasheet - Page 29

• Manufacturer Part Number: PMJ5918TSR
• Description: DC/DC Converters & Regulators 0.8-3.6V 30A Non-Iso Input 5V 108W
• Manufacturer: Ericsson Power Modules
• Series: PMJr

Specifications of PMJ5918TSR

• Product: Non-Isolated / POL
• Output Power: 108 W
• Input Voltage Range: 4.5 V to 5.5 V
• Number Of Outputs: 1
• Output Voltage (channel 1): 0.8 V to 3.6 V
• Output Current (channel 1): 30 A
• Output Type: POLA Non-Isolated Regulator
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

Soldering Information - Surface mounting
The surface mount version of the product is intended for
convection or vapor phase reflow Pb-free processes. To
achieve a good and reliable soldering result, make sure to
follow the recommendations from the solder paste supplier,
to use state-of-the-art reflow equipment and reflow profiling
techniques as well as the following guidelines.
A no-clean flux is recommended to avoid entrapment of
cleaning fluids in cavities inside of the DC/DC regulator. The
cleaning residues may affect long time reliability and isolation
voltage.
Minimum pin temperature recommendations
Pin number 12 is chosen as reference location for the
minimum pin temperature recommendations since this will be
the coolest solder joint during the reflow process.
SnPb solder processes
For Pb solder processes, a pin temperature (T
the solder melting temperature, (T
for more than 30 seconds, and a peak temperature of
+210 °C is recommended to ensure a reliable solder joint.
Lead-free (Pb-free) solder processes
For Pb-free solder processes, a pin temperature (T
excess of the solder melting temperature (T
for Sn/Ag/Cu solder alloys) for more than 30 seconds, and a
peak temperature of +235 °C on all solder joints is
recommended to ensure a reliable solder joint.
Prepared (also subject responsible if other)
SEC/D EPANHON
Approved
SEC/D (Linda Zhong)
PMJ 5000 series
POL regulator, Input 4.5-5.5 V, Output 30 A/108 W
PIN 12 for measurement of
minimum solder joint
temperature, T
PIN
L
, +183 °C for Sn63/Pb37)
Main transformer for
measurement of Max
product temperature, T
L
, +217 to +221 °C
PIN
) in excess of
Checked
See end
PIN
) in
P
PRODUCT SPECIFICATION
No.
4/1301-BMR 646
Date
2006-2-14
Maximum regulator temperature requirements
To avoid damage or performance degradation of the product,
the reflow profile should be optimized to avoid excessive
heating. The maximum product temperature shall be
monitored by attaching a thermocoupler to the top of the
main transformer.
A sufficiently extended preheat time is recommended to
ensure an even temperature across the host PCB, for both
small and large devices. To reduce the risk of excessive
heating is also recommended to reduce the time in the reflow
zone as much as possible.
SnPb solder processes(PENDING)
For conventional SnPb solder processes, the product is
qualified for MSL 1 according to IPC/JEDEC standard
J-STD-020C.
During reflow, T
Lead-free (Pb-free) solder processes
For Pb-free solder processes, the product is qualified for
MSL 3 according to IPC/JEDEC standard J-STD-020C.
During reflow, T
25 °C
Profile features
Average ramp-up rate
Solder melting
temperature (typical)
Peak product temperature T
Average ramp-down rate
Time 25 °C to peak
temperature
Temperature
T
T
P
L
P
P
must not exceed +225 °C at any time.
must not exceed +260 °C at any time.
Technical Specifi cation
EN/LZT 146 326 R1B April 2006
© Ericsson Power Modules AB
Rev
B
Time 25 °C to peak
T
Preheat
L
P
Sn/Pb eutectic
assembly
3 °C/s max
+183 °C
+225 °C
6 °C/s max
6 minutes max
Ramp-up
Reference
Reflow
Pb-free assembly
3 °C/s max
+221 °C
+260 °C
6 °C/s max
8 minutes max
Ramp-down
(cooling)
Time
3 (7)
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