PCA9665PW/S911,118 NXP Semiconductors, PCA9665PW/S911,118 Datasheet - Page 85
PCA9665PW/S911,118
Manufacturer Part Number
PCA9665PW/S911,118
Description
IC CNTRLR PARALLEL/I2C 20TSSOP
Manufacturer
NXP Semiconductors
Datasheet
1.PCA9665PWS911118.pdf
(90 pages)
Specifications of PCA9665PW/S911,118
Controller Type
I²C Bus Controller
Interface
I²C
Voltage - Supply
2.3 V ~ 3.6 V
Current - Supply
100µA
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
20-TSSOP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
935285487118
PCA9665PW/S911-T
PCA9665PW/S911-T
PCA9665PW/S911-T
PCA9665PW/S911-T
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NXP Semiconductors
PCA9665_3
Product data sheet
17.4 Reflow soldering
Key characteristics in reflow soldering are:
Table 54.
Table 55.
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see
Package thickness (mm)
< 2.5
Package thickness (mm)
< 1.6
1.6 to 2.5
> 2.5
•
•
•
•
•
2.5
Process issues, such as application of adhesive and flux, clinching of leads, board
transport, the solder wave parameters, and the time during which components are
exposed to the wave
Solder bath specifications, including temperature and impurities
Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see
reducing the process window
Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 54
SnPb eutectic process (from J-STD-020C)
Lead-free process (from J-STD-020C)
and
Figure
55
50.
Rev. 03 — 12 August 2008
Package reflow temperature ( C)
Volume (mm
< 350
235
220
Package reflow temperature ( C)
Volume (mm
< 350
260
260
250
3
3
)
)
Figure
350 to 2000
260
250
245
Fm+ parallel bus to I
50) than a SnPb process, thus
220
220
350
> 2000
260
245
245
PCA9665
© NXP B.V. 2008. All rights reserved.
2
C-bus controller
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