ISP1160BM01-S ST-Ericsson Inc, ISP1160BM01-S Datasheet - Page 87

• Manufacturer Part Number: ISP1160BM01-S
• Description: IC USB HOST CONTROLLER 64LQFP
• Manufacturer: ST-Ericsson Inc

Specifications of ISP1160BM01-S

• Controller Type: USB 2.0 Controller
• Interface: Parallel
• Voltage - Supply: 3.3V, 5V
• Current - Supply: 47mA
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 64-LQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Philips Semiconductors
22. Revision history
Table 77:
9397 750 13963
Product data
Rev Date
05
04
03
02
01
20041224 200412019
20030704 -
20030227 -
20020912 -
20020104 -
Revision history
CPCN
[3]
[4]
[5]
[6]
[7]
[8]
[9]
Description
Product data (9397 750 13963)
Modifications:
Product data (9397 750 11371)
Product data (9397 750 10765)
Product data (9397 750 09628)
Objective data (9397 750 09161)
•
•
•
These transparent plastic packages are extremely sensitive to reflow soldering conditions and must
on no account be processed through more than one soldering cycle or subjected to infrared reflow
soldering with peak temperature exceeding 217 C
oven. The package body peak temperature must be kept as low as possible.
These packages are not suitable for wave soldering. On versions with the heatsink on the bottom
side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with
the heatsink on the top side, the solder might be deposited on the heatsink surface.
If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave
direction. The package footprint must incorporate solder thieves downstream and at the side corners.
Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it
is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
Wave soldering is suitable for SSOP, TSSOP, VSO and VSOP packages with a pitch (e) equal to or
larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than
0.5 mm.
Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered
pre-mounted on flex foil. However, the image sensor package can be mounted by the client on a flex
foil by using a hot bar soldering process. The appropriate soldering profile can be provided on
request.
Hot bar soldering or manual soldering is suitable for PMFP packages.
Figure 2 “Pin configuration
Table 2 “Pin description
A2.
Section 9.8.1 “Using an internal OC detection
sentence, changed source to drain and drain to source.
Rev. 05 — 24 December 2004
LQFP64”: in the description for pin 60, changed address A1 to
LQFP64.”: added a figure note.
circuit”: fourth paragraph, second
10 C measured in the atmosphere of the reflow
Embedded USB Host Controller
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.
ISP1160
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