UPD720102GC-YEB-A Renesas Electronics America, UPD720102GC-YEB-A Datasheet - Page 34

• Manufacturer Part Number: UPD720102GC-YEB-A
• Description: IC HOST CTLR USB2.0 3-PORTS QFP
• Manufacturer: Renesas Electronics America

Specifications of UPD720102GC-YEB-A

• Controller Type: USB 2.0 Controller
• Interface: PCI
• Voltage - Supply: 3.135 V ~ 3.465 V
• Operating Temperature: -20°C ~ 70°C
• Mounting Type: Surface Mount
• Package / Case: 120-TQFP
• Package Type: TQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Current - Supply: -
• Lead Free Status / RoHS Status: Compliant, Lead free / RoHS Compliant

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5. RECOMMENDED SOLDERING CONDITIONS
representative.
•
•
32
Note The Maximum number of days during which the product can be stored at a temperature of 5 to 25°C and a
Note The Maximum number of days during which the product can be stored at a temperature of 5 to 25°C and a
μ
Infrared reflow
Partial heating method
μ
Infrared reflow
The
For soldering methods and conditions other than those recommended below, contact an NEC Electronics sales
For technical information, see the following website.
Semiconductor Device Mount Manual (http://www.necel.com/pkg/en/mount/index.html)
PD720102GC-YEB-A: 120-pin plastic TQFP (Fine pitch) (14 × 14)
PD720102F1-CA7-A: 121-pin plastic FBGA (8 × 8)
Soldering Method
Soldering Method
μ
relative humidity of 20 to 65% after dry-pack package is opened.
relative humidity of 20 to 65% after dry-pack package is opened.
PD720102 should be soldered and mounted under the following recommended conditions.
Peak package’s surface temperature: 260 °C, Reflow time: 60 seconds or less
(220 °C or higher), Maximum allowable number of reflow processes: 3,
Exposure limit
afterwards),
Flux: Rosin flux with low chlorine (0.2 Wt% or below) recommended.
<Caution>
Non-heat-resistant trays, such as magazine and taping trays, cannot be baked
before unpacking.
Pin temperature: 350°C or below,
Heat time: 3 seconds or less (per each side of the device) ,
Flux: Rosin flux with low chlorine (0.2 Wt% or below) recommended.
Peak package’s surface temperature: 260 °C, Reflow time: 60 seconds or less
(220 °C or higher), Maximum allowable number of reflow processes: 3,
Exposure limit
afterwards),
Flux: Rosin flux with low chlorine (0.2 Wt% or below) recommended.
<Caution>
Non-heat-resistant trays, such as magazine and taping trays, cannot be baked
before unpacking.
Note
Note
: 7 days (10 to 72 hours pre-backing is required at 125C°
: 7 days (10 to 72 hours pre-backing is required at 125C°
Data Sheet S17998EJ4V0DS
Soldering Conditions
Soldering Conditions
IR60-107-3
IR60-107-3
μ
Symbol
Symbol
PD720102
–