MAX1951ESA+TW Maxim Integrated Products, MAX1951ESA+TW Datasheet - Page 2

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MAX1951ESA+TW

Manufacturer Part Number
MAX1951ESA+TW
Description
DC/DC Switching Regulators 1MHz 2A 2.6-5.5V PWM DC/DC Step-Down
Manufacturer
Maxim Integrated Products
Datasheet

Specifications of MAX1951ESA+TW

Lead Free Status / Rohs Status
Lead free / RoHS Compliant
ABSOLUTE MAXIMUM RATINGS
1MHz, All-Ceramic, 2.6V to 5.5V Input,
2A PWM Step-Down DC-to-DC Regulators
ELECTRICAL CHARACTERISTICS
(V
T
IN, V
COMP, FB, REF to GND .............................-0.3V to (V
LX to Current (Note 1).........................................................±4.5A
PGND to GND .............................................Internally Connected
Continuous Power Dissipation (T A = +85°C)
Package Junction-to-Ambient
Note 1: LX has internal clamp diodes to PGND and IN. Applications that forward bias these diodes should take care not to exceed
Note 2: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
2
IN AND V
IN Voltage Range
Supply Current
Shutdown Current
V
Threshold
REF
REF Voltage
REF Load Regulation
REF Line Regulation
REF Shutdown Resistance
COMP
COMP Transconductance
COMP Clamp Voltage, Low
COMP Clamp Voltage, High
COMP Shutdown Resistance
COMP Shutdown Threshold
COMP Startup Current
FB
Output Voltage Range
(MAX1951)
FB Regulation Voltage
(Error Amp Only)
FB Input Resistance
FB Input Bias Current
A
IN
CC
8-Pin SO (derate 12.2mW/°C above +70°C)................976mW
Thermal Resistance (θ
= +25°C.)
_______________________________________________________________________________________
= V
CC
Undervoltage Lockout
to GND ........................................................-0.3V to +6V
CC
the IC’s package power dissipation limits.
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
PARAMETER
CC
= 3.3V, PGND = GND, FB in regulation, C
JA
) (Note 2)...............................82°C/W
S w i tchi ng w i th no l oad , LX unconnected
COMP = GND
When LX starts/stops switching
I
I
I
From REF to GND, COMP = GND
From FB to COMP, V
V
V
From COMP to GND, V
When LX starts/stops switching
COMP = GND
When using external feedback resistors to drive FB
V
I
REF
REF
REF
OU T
IN
IN
C OM P
= 2.6V to 5.5V, V
= 2.6V to 5.5V, V
= 0µA, V
= 0 to 40µA, V
= 20µA, V
= 0 to 1.5A
= 1V to 2V ,
IN
IN
= 2.6V to 5.5V
= 2.6V to 5.5V
CC
IN
REF
V
V
FB
FB
COMP
CONDITIONS
= 2.6V to 5.5V
IN
IN
+ 0.3V)
IN
= 1.3V
= 1.1V
= 0.1µF, T
= 2.6V to 5.5V MAX1951
= 2.8V to 5.5V MAX1952
= 2V
= 1.25V
A
Package Junction-to-Case
Operating Temperature Range
Junction Temperature Range ............................-40°C to +150°C
Storage Temperature Range .............................-65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
= 0°C to +85°C, unless otherwise noted. Typical values are at
Thermal Resistance (θ
MAX195_ ESA..................................................-40°C to +85°C
V
V
V
MAX1951
MAX1952
COMP rising
COMP falling
MAX1952
MAX1951
IN
CC
CC
= 5.5V
rising
falling
0.787
1.773
JC
MIN
1.96
26.7
1.97
0.17
-0.1
2.6
0.6
0.8
40
15
13
2
) (Note 2) ..............................32°C/W
0.795
TYP
2.35
2.25
0.01
0.01
2.15
0.5
0.6
0.4
1.8
12
60
40
15
25
18
6
2
1
V
0.803
1.827
MAX
+0.1
2.03
53.3
2.28
IN
5.5
1.0
2.5
0.2
0.4
1.2
10
22
80
30
40
28
1
UNITS
mA
mA
µS
µA
µA
%
%
Ω
Ω
V
V
V
V
V
V
V
V

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