ICL3227ECAZA-T Intersil, ICL3227ECAZA-T Datasheet - Page 14

• Manufacturer Part Number: ICL3227ECAZA-T
• Description: TRANSMITTER/RCVR RS232 16-SSOP
• Manufacturer: Intersil
• Type: Transceiverr

Specifications of ICL3227ECAZA-T

• Number Of Drivers/receivers: 1/1
• Protocol: RS232
• Voltage - Supply: 3 V ~ 5.5 V
• Mounting Type: Surface Mount
• Package / Case: 16-SSOP
• Rohs Compliant: YES
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: ICL3227ECAZA-TTR

Human Body Model (HBM) Testing
As the name implies, this test method emulates the ESD
event delivered to an IC during human handling. The tester
delivers the charge through a 1.5kΩ current limiting resistor,
making the test less severe than the IEC61000 test which
utilizes a 330Ω limiting resistor. The HBM method
determines an ICs ability to withstand the ESD transients
typically present during handling and manufacturing. Due to
the random nature of these events, each pin is tested with
respect to all other pins. The RS-232 pins on “E” family
devices can withstand HBM ESD events to ±15kV.
IEC61000-4-2 Testing
The IEC61000 test method applies to finished equipment,
rather than to an individual IC. Therefore, the pins most likely
to suffer an ESD event are those that are exposed to the
outside world (the RS-232 pins in this case), and the IC is
tested in its typical application configuration (power applied)
rather than testing each pin-to-pin combination. The lower
current limiting resistor coupled with the larger charge
storage capacitor yields a test that is much more severe than
Typical Performance Curves
FIGURE 15. TRANSMITTER OUTPUT VOLTAGE vs LOAD
-2
-4
-6
6
4
2
0
0
1 TRANSMITTER AT 1Mbps
OTHER TRANSMITTERS AT 30kbps
CAPACITANCE
1000
LOAD CAPACITANCE (pF)
2000
14
3000
V
ICL3225E, ICL3227E, ICL3245E
CC
V
V
OUT
4000
OUT
= 3.3V, T
+
-
A
5000
= 25°C
the HBM test. The extra ESD protection built into this
device’s RS-232 pins allows the design of equipment
meeting level 4 criteria without the need for additional board
level protection on the RS-232 port.
AIR-GAP DISCHARGE TEST METHOD
For this test method, a charged probe tip moves toward the
IC pin until the voltage arcs to it. The current waveform
delivered to the IC pin depends on approach speed,
humidity, temperature, etc., so it is difficult to obtain
repeatable results. The “E” device RS-232 pins withstand
±15kV air-gap discharges.
CONTACT DISCHARGE TEST METHOD
During the contact discharge test, the probe contacts the
tested pin before the probe tip is energized, thereby
eliminating the variables associated with the air-gap
discharge. The result is a more repeatable and predictable
test, but equipment limits prevent testing devices at voltages
higher than ±8kV. All “E” family devices survive ±8kV contact
discharges on the RS-232 pins.
110
90
70
50
30
10
0
FIGURE 16. SLEW RATE vs LOAD CAPACITANCE
0
-SLEW
+SLEW
1000
LOAD CAPACITANCE (pF)
2000
3000
4000
February 27, 2006
FN4900.9
5000