DSPIC30F3012-30I/P Microchip Technology Inc., DSPIC30F3012-30I/P Datasheet - Page 164

• Manufacturer Part Number: DSPIC30F3012-30I/P
• Description: 16 BIT MCU/DSP 18LD 30MIPS 24 KB FLASH
• Manufacturer: Microchip Technology Inc.
• Type: DSPr

Specifications of DSPIC30F3012-30I/P

• A/d Inputs: 8-Channels, 12-Bit
• Cpu Speed: 30 MIPS
• Eeprom Memory: 1K Bytes
• Input Output: 12
• Interface: I2C/SPI/UART, USART
• Ios: 12
• Memory Type: Flash
• Number Of Bits: 16
• Package Type: 18-pin PDIP
• Programmable Memory: 24K Bytes
• Ram Size: 2K Bytes
• Timers: 3-16-bit, 1-32-bit
• Voltage, Range: 2.5-5.5
• Lead Free Status / Rohs Status: RoHS Compliant part Electrostatic Device

dsPIC30F2011/2012/3012/3013
FIGURE 20-7:
TABLE 20-22: BAND GAP START-UP TIME REQUIREMENTS
DS70139D-page 162
AC CHARACTERISTICS
SY40
Note 1:
Param
(see Note)
Note: Set LVDEN bit (RCON<12>) or FBORPOR<7>set.
Enable Band Gap
No.
2:
T
Symbol
These parameters are characterized but not tested in manufacturing.
Data in “Typ” column is at 5V, 25°C unless otherwise stated.
BGAP
0V
Band Gap Start-up Time
BAND GAP START-UP TIME CHARACTERISTICS
Characteristic
(1)
SY40
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature
Min
—
Typ
40
(2)
Max
65
Units
-40°C
-40°C
µs
Defined as the time between the
instant that the band gap is enabled
and the moment that the band gap
reference voltage is stable.
RCON<13> bit
T
T
A
A
+85°C for Industrial
+125°C for Extended
© 2006 Microchip Technology Inc.
Conditions
V
BGAP
Band Gap
Stable