DSPIC30F3012-30I/P Microchip Technology Inc., DSPIC30F3012-30I/P Datasheet - Page 203

no-image

DSPIC30F3012-30I/P

Manufacturer Part Number
DSPIC30F3012-30I/P
Description
16 BIT MCU/DSP 18LD 30MIPS 24 KB FLASH
Manufacturer
Microchip Technology Inc.
Type
DSPr
Datasheet

Specifications of DSPIC30F3012-30I/P

A/d Inputs
8-Channels, 12-Bit
Cpu Speed
30 MIPS
Eeprom Memory
1K Bytes
Input Output
12
Interface
I2C/SPI/UART, USART
Ios
12
Memory Type
Flash
Number Of Bits
16
Package Type
18-pin PDIP
Programmable Memory
24K Bytes
Ram Size
2K Bytes
Timers
3-16-bit, 1-32-bit
Voltage, Range
2.5-5.5
Lead Free Status / Rohs Status
RoHS Compliant part Electrostatic Device

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DSPIC30F3012-30I/P
Manufacturer:
Microchip Technology
Quantity:
1 936
Part Number:
DSPIC30F3012-30I/P
Manufacturer:
TI
Quantity:
6
Part Number:
DSPIC30F3012-30I/P
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
Part Number:
DSPIC30F3012-30I/PT
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
© 2006 Microchip Technology Inc.
Architecture
Trademark
Example:
dsPIC30F3013AT-30I/SP = 30 MIPS, Industrial temp., SPDIP package, Rev. A
Memory Size in Bytes
0 = ROMless
1 = 1K to 6K
2 = 7K to 12K
3 = 13K to 24K
4 = 25K to 48K
5 = 49K to 96K
6 = 97K to 192K
7 = 193K to 384K
8 = 385K to 768K
9 = 769K and Up
Device ID
Flash
d s P I C 3 0 F 3 0 1 3 AT - 3 0 I / S P - E S
dsPIC30F2011/2012/3012/3013
Temperature
I = Industrial -40°C to +85°C
E = Extended High Temp -40°C to +125°C
Package
P
SO = SOIC
SP = SPDIP
ML = QFN (8x8)
A,B,C… = Revision Level
Custom ID (3 digits) or
Engineering Sample (ES)
= DIP
T = Tape and Reel
DS70139D-page 201
Speed
20 = 20 MIPS
30 = 30 MIPS

Related parts for DSPIC30F3012-30I/P