DSPIC30F2012-30I/SP Microchip Technology Inc., DSPIC30F2012-30I/SP Datasheet - Page 192

• Manufacturer Part Number: DSPIC30F2012-30I/SP
• Description: DSP, 16-Bit, 12 KB Flash, 1KB RAM, 20 I/O, PDIP-28
• Manufacturer: Microchip Technology Inc.
• Type: DSPr

Specifications of DSPIC30F2012-30I/SP

• A/d Inputs: 10-Channels, 12-Bit
• Cpu Speed: 30 MIPS
• Eeprom Memory: 0 Bytes
• Input Output: 20
• Interface: I2C, SPI, UART/USART
• Ios: 20
• Memory Type: Flash
• Number Of Bits: 16
• Package Type: 28-pin SPDIP
• Programmable Memory: 12K Bytes
• Ram Size: 1K Bytes
• Timers: 3-16-bit, 1-32-bit
• Voltage, Range: 2.5-5.5
• Lead Free Status / Rohs Status: RoHS Compliant part Electrostatic Device

dsPIC30F2011/2012/3012/3013
44-Lead Plastic Quad Flat, No Lead Package (ML) - 8x8 mm Body [QFN]
DS70139E-page 190
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
A3
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic
3. Package is saw singulated
4. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
TOP VIEW
Number of Pins
Pitch
Overall Height
Standoff
Contact Thickness
Overall Width
Exposed Pad Width
Overall Length
Exposed Pad Length
Contact Width
Contact Length §
Contact-to-Exposed Pad §
D
N
A1
Microchip Technology Drawing No. C04–103, Sept. 8, 2006
Dimension Limits
2
1
E
EXPOSED
A
NOTE 1
PAD
Units
E2
A1
A3
E2
D2
N
A
E
D
K
e
b
L
2
1
MIN
0.80
0.00
6.30
6.30
0.25
0.30
0.20
N
BOTTOM VIEW
MILLIMETERS
0.65 BSC
8.00 BSC
8.00 BSC
0.20 REF
NOM
0.90
0.02
6.45
6.45
0.30
0.40
D2
44
—
© 2006 Microchip Technology Inc.
L
MAX
1.00
0.05
6.80
6.80
0.38
0.50
—
e
b
K