PMD5003K T/R NXP Semiconductors, PMD5003K T/R Datasheet

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PMD5003K T/R

Manufacturer Part Number
PMD5003K T/R
Description
MOSFET & Power Driver ICs MOSFET DRIVER TAPE 7
Manufacturer
NXP Semiconductors
Datasheet

Specifications of PMD5003K T/R

Maximum Power Dissipation
485 mW
Maximum Operating Temperature
+ 150 C
Mounting Style
SMD/SMT
Package / Case
SMT
Minimum Operating Temperature
- 65 C
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
PMD5003K,115
1. Product profile
1.1 General description
1.2 Features
1.3 Applications
1.4 Quick reference data
PNP low V
switching diode to protect the base-emitter junction in reverse direction in a SOT346
(SC-59A/TO-236) small Surface-Mounted Device (SMD) plastic package.
I
I
I
I
I
I
I
Table 1.
[1]
Symbol
PNP transistor
V
I
I
Diode
I
V
C
CM
F
CEO
F
PMD5003K
MOSFET driver
Rev. 01 — 6 November 2006
Low V
High-speed switching diode to protect the base-emitter junction
Application-optimized pinout
Internal connections to minimize layout effort
Space-saving solution
Reduces component count
Power MOSFET driver
Pulse test: t
CEsat
CEsat
Quick reference data
Parameter
collector-emitter voltage
collector current
peak collector current
forward current
forward voltage
p
(BISS) transistor and high-speed switching diode as driver
Breakthrough In Small Signal (BISS) transistor and high-speed
300 s;
0.02.
Conditions
open base
single pulse;
t
I
p
F
= 200 mA
1 ms
[1]
Min
-
-
-
-
-
Typ
-
-
-
-
-
Product data sheet
Max
0.2
1.1
40
1
2
Unit
V
A
A
A
V

Related parts for PMD5003K T/R

PMD5003K T/R Summary of contents

Page 1

PMD5003K MOSFET driver Rev. 01 — 6 November 2006 1. Product profile 1.1 General description PNP low V switching diode to protect the base-emitter junction in reverse direction in a SOT346 (SC-59A/TO-236) small Surface-Mounted Device (SMD) plastic package. 1.2 Features ...

Page 2

... NXP Semiconductors 2. Pinning information Table 2. Pin Ordering information Table 3. Type number PMD5003K 4. Marking Table 4. Type number PMD5003K PMD5003K_1 Product data sheet Pinning Description base TR1, anode D1 emitter TR1, cathode D1 collector TR1 Ordering information Package Name Description SC-59A plastic surface-mounted package; 3 leads Marking codes Rev. 01 — ...

Page 3

... NXP Semiconductors 5. Limiting values Table 5. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol PNP transistor V CBO V CEO tot Diode FRM I FSM Device amb T stg [1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint. [2] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 1 cm ...

Page 4

... NXP Semiconductors (1) Ceramic PCB, Al (2) FR4 PCB, mounting pad for collector 1 cm (3) FR4 PCB, standard footprint Fig 1. Power derating curves 6. Thermal characteristics Table 6. Symbol PNP transistor R th(j-a) [1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. [2] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 1 cm ...

Page 5

... NXP Semiconductors 3 10 duty cycle = 1 Z th(j-a) 0.75 (K/W) 0.5 0. 0.2 0.1 0.05 10 0.02 0. FR4 PCB, standard footprint Fig 2. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values 3 10 duty cycle = Z th(j-a) 1 (K/W) 0.75 0 0.33 0.2 0.1 0. ...

Page 6

... NXP Semiconductors duty cycle = th(j-a) (K/W) 1 0.75 0 0.33 0.2 0.1 0.05 10 0.02 0. Ceramic PCB standard footprint 2 3 Fig 4. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values PMD5003K_1 Product data sheet Rev. 01 — 6 November 2006 PMD5003K MOSFET driver ...

Page 7

... NXP Semiconductors 7. Characteristics Table 7. Symbol Parameter PNP transistor I CBO CEsat V BEsat V BE Diode V F Device off Device with optional capacitor off [1] Pulse test: t PMD5003K_1 Product data sheet Characteristics Conditions collector-base cut-off current 150 current gain collector-emitter I = 100 mA saturation voltage I = 500 mA base-emitter saturation I = 100 mA ...

Page 8

... NXP Semiconductors 600 h FE 400 (2) (3) (4) (5) (1) 200 ( amb ( amb ( 100 C amb ( 125 C amb ( 150 C amb Fig 5. DC current gain as a function of collector current; typical values 1 (V) 0.8 (1) (2) 0.6 (3) 0 amb ( amb ( 100 C amb Fig 7. Base-emitter voltage as a function of collector current ...

Page 9

... NXP Semiconductors CEsat (V) (1) ( 100 C amb ( amb ( amb Fig 9. Collector-emitter saturation voltage as a function of collector current; typical values 8. Test information Fig 11. Test circuit for switching times PMD5003K_1 Product data sheet 006aaa907 V CEsat ( (mA) C (1) I (2) I (3) I Fig 10. Collector-emitter saturation voltage as a (probe) ...

Page 10

... NXP Semiconductors 9. Package outline Fig 12. Package outline SOT346 (SC-59A/TO-236) 10. Packing information Table 8. The indicated -xxx are the last three digits of the 12NC ordering code. Type number PMD5003K [1] For further information and the availability of packing methods, see PMD5003K_1 Product data sheet 3.1 2 ...

Page 11

... NXP Semiconductors 11. Soldering Fig 13. Reflow soldering footprint Fig 14. Wave soldering footprint PMD5003K_1 Product data sheet 0.70 (3x) 3.15 1 solder lands solder paste 4.70 2.80 5.20 4.60 1.20 1 1.20 (2x) 3.40 preferred transport direction during soldering Rev. 01 — 6 November 2006 PMD5003K 3.30 1.00 ...

Page 12

... NXP Semiconductors 12. Mounting 0.8 Dimensions in mm Fig 15. FR4 PCB, standard footprint; PMD5003K_1 Product data sheet 43.4 0.7 0.5 006aaa674 PCB thickness: FR4 PCB = 1.6 mm ceramic PCB = 0.635 mm ceramic PCB standard 2 3 footprint Rev. 01 — 6 November 2006 PMD5003K 43 0.8 0.7 Dimensions in mm PCB thickness = 1 ...

Page 13

... NXP Semiconductors 13. Revision history Table 9. Revision history Document ID Release date PMD5003K_1 20061106 PMD5003K_1 Product data sheet Data sheet status Change notice Product data sheet - Rev. 01 — 6 November 2006 PMD5003K MOSFET driver Supersedes - © NXP B.V. 2006. All rights reserved ...

Page 14

... For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail ...

Page 15

... NXP Semiconductors 16. Contents 1 Product profi 1.1 General description 1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 Quick reference data Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 Limiting values Thermal characteristics Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 7 8 Test information . . . . . . . . . . . . . . . . . . . . . . . . . 9 9 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 10 10 Packing information Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 12 Mounting ...

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