STM32L152-SK/IAR STMicroelectronics, STM32L152-SK/IAR Datasheet - Page 96

• Manufacturer Part Number: STM32L152-SK/IAR
• Description: MCU, MPU & DSP Development Tools STM32L152VBT6 IAR 32KB Workbench
• Manufacturer: STMicroelectronics
• Series: IAR Kickstartr
• Type: MCUr

Specifications of STM32L152-SK/IAR

• Contents: Board, CD
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• For Use With/related Products: STM32L

Package characteristics
96/107
1. Drawing is not to scale.
2. All leads/pads should also be soldered to the PCB to improve the lead/pad solder joint life.
3. There is an exposed die pad on the underside of the UFQFPN package. It is recommended to connect and solder this
Figure 31. UFQFPN48 7 x 7 mm, 0.5 mm pitch, package
back-side pad to PCB ground.
Table 57.
1. Values in inches are converted from mm and rounded to 4 decimal digits.
A
A1
D
E
L
T
b
e
outline
Symbol
(1)(2)(3)
UFQFPN48 – ultra thin fine pitch quad flat pack no-lead 7 × 7 mm, 0.5 mm
pitch package mechanical data
0.500
0.000
6.900
6.900
0.300
0.200
Typ
millimeters
0.550
7.000
7.000
0.400
0.152
0.250
0.500
0.020
Doc ID 17659 Rev 4
Min
0.600
0.050
7.100
7.100
0.500
0.300
Max
Figure 32. Recommended footprint
7.30
0.30
0.55
0.0197
0.0000
0.2717
0.2717
0.0118
0.0079
0.20
Typ
12
1
STM32L151xx, STM32L152xx
48
13
(dimensions in mm)
6.20
inches
0.0217
0.2756
0.2756
0.0157
0.0060
0.0098
0.0197
7.30
5.60
5.80
0.0008
6.20
Min
(1)
5.60
0.50
37
24
36
25
0.0236
0.0020
0.2795
0.2795
0.0197
0.0118
0.75
Max
(1)
5.80
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