20102 OK International, 20102 Datasheet - Page 17

• Manufacturer Part Number: 20102
• Description: Soldering Tools Micrometer Head
• Manufacturer: OK International

Specifications of 20102

• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

16. Turn the vacuum switch (16) to the “on” position.
17. While unlocked, push the spring-loaded head on the Micro Oven down so that the vacuum cup makes a
18. With the vacuum switch still in the “on” position, press the start button or click on the start icon to
19. Raise the nozzle assembly off of the PCB by rotating the “Z” axis lever on the reflow arm clockwise.
10. Using a heat resistant material, position it under the nozzle and turn the vacuum off. This will release
Please do not use your hand to catch the component, even after the cooling cycle, the component can be
extremely hot.
SITE PREPARATION:
Solder Removal
Prepare the site to receive a new component by removing all of the residual solder. This can be done using
the supplied Metcal MX-500 Series Rework System with blade cartridge assembly. Employing Metcal Smart
Heat™ Technology into your rework process will eliminate the potential of accidentally removing any pads
when removing residual solder. This is because Metcal’s patented Smart Heat™ technology ensures that tip
temperature is constantly maintained, regardless of the thermal demand of the assembly that is being
reworked. For more information on Metcal Smart Heat™Technology, please contact your local Metcal repre-
sentative or Metcal directly.
The following blade style tips are available for the Metcal MX-500 Series Rework System:
SMTC-x60 (.410” length)
SMTC-x61 (.620” length)
Please note that “x” denotes tip temperature. All cartridges are available in 500, 600 and 700 series
styles. (5 = 500°F, 0=600°F and 1=700°F)
As an option you can use a vacuum desoldering system such as the Metcal SP440 Self-Contained or MX-
500DS Shop-Air Desolder/Solder Rework System to vacuum residual solder from the PCB.
NOTE ON CLEANING
Although cotton swaps soaked with isopropyl alcohol work satisfactory for removing flux residue, it is strong-
BGA-3500 Series Manual 5/01
complete seal on the BGA component which you are removing and then lock the head into place by
tightening the “Z” axis locking knob. You will see the vacuum indicator LED illuminate indicating cor-
rect position and seal to the top of the component.
NOTE: When locking the vacuum tube assembly, excessive downward pressure may damage the vacuum
tube and not allow the component to lift. Please use light pressure!
begin the removal cycle. The system will cycle through the complete profile and automatically lift the
component off the board.
Application Note: When running a removal profile, it is recommended you insert the supplied K-Type
thermocouple between the target component and the PCB so that the thermocouple is in contact with,
and will accurately measure the temperature of the solder joint you are attempting to reflow. The ther-
mocouple can be secured to the PCB with the enclosed Kapton Tape. When developing a profile, this
will allow you to read an accurate solder joint temperature and make any “On-the-fly” changes.
The BGA component that you have just removed will be suspended inside the nozzle by the vacuum
tube.
the component from the BGA head assembly.
SMTC-x62 (.870” length)
SMTC-x110 (1.55” length)
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