20102 OK International, 20102 Datasheet - Page 28

• Manufacturer Part Number: 20102
• Description: Soldering Tools Micrometer Head
• Manufacturer: OK International

Specifications of 20102

• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

The concept of the profile:
A profile is the relationship between the temperature and time for a given placement or removal process. The profile is broken into
four components known as the Preheat zone, soak zone, peak zone, and cool zone. Each zone has user definable temperature and time
settings allowing the user to create a profile for almost any removal or placement process.
There are two kinds of profiles: One is known as module profile that is stored in the memory device inside the BGA module. The
other known as Library Profile carries more information and is stored on the user-selected drive of their computer. Any profile can
be stored in the preferred location. Periodically, the user should back up profiles by saving onto floppy disk.
Preheat zone is used to pre-heat the circuit board and component in order to drive off moisture that may have been absorbed by
multilayer boards and prevent from the possibility of “popcorning” (local delamination of the part or circuit board). The set
temperature for top and bottom side is identical.
Soak zone has two temperate settings. One setting is for the preheater that is used to maintain the heat beneath the circuit board.
The second setting is the temperature of the top air that heats all of the solder joints under the micro oven to the sub melting
temperature and ensures joints will melt at Peak zone.
Peak zone also has two temperature settings that are similar to Soak zone. The appropriate temperature of the top air should be set
in order to ensure solder joints reach their melting point. Note: For the removal mode, the pick-up solenoid will be triggered at the
end of this cycle allowing the component to be automatically removed from the PCB.
Cool zone is used to cool down the chamber of the micro oven and the solder connections in the place mode, allowing the solder
to solidify at a steady ramp rate and increase solder connection reliability. In the removal mode, the cooling cycle is necessary if
the component is reused and to cool the PCB correctly.
Select temperature scale
Editing Fields of Soak Zone
Editing Fields of Cool Zone
Restore Settings from BGA Module.
THE PROFILE
The Library Profile
The Module Profile
Editing Fields of Preheat Zone
Editing Fields of Peak Zone
Select the graphics display
Update settings of BGA Module
ADDENDUM A
Select the placement
or removal process.
Hardware and process
description area.
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