MT47H128M16PK-25E IT:C Micron Technology Inc, MT47H128M16PK-25E IT:C Datasheet - Page 19

• Manufacturer Part Number: MT47H128M16PK-25E IT:C
• Manufacturer: Micron Technology Inc

Specifications of MT47H128M16PK-25E IT:C

• Lead Free Status / Rohs Status: Not Compliant

Packaging
Package Dimensions
Figure 8: 84-Ball FBGA Package (11.5mm x 14mm) – x16
PDF: 09005aef824f87b6
2gbddr2.pdf – Rev. E 06/10 EN
Seating
11.2 CTR
Solder ball
material: SAC305.
Dimensions apply
to solder balls post-
reflow on Ø0.33
NSMD ball
pads.
plane
0.12
84X Ø0.45
0.8 TYP
A
A
Notes:
9 8 7
1. All dimensions are in millimeters.
2. Solder ball material: SAC305 (96.5% Sn, 3% Ag, 0.5% Cu).
11.5 ±0.15
0.8 TYP
6.4 CTR
3 2 1
0.8 ±0.1
A
B
C
D
E
F
G
H
J
K
L
M
N
P
Q
Ball A1 ID
14 ±0.15
19
Micron Technology, Inc. reserves the right to change products or specifications without notice.
0.25 MIN
2Gb: x4, x8, x16 DDR2 SDRAM
1.2 MAX
Ball A1 ID
© 2006 Micron Technology, Inc. All rights reserved.
Packaging