MT47H128M16PK-25E IT:C Micron Technology Inc, MT47H128M16PK-25E IT:C Datasheet - Page 22

• Manufacturer Part Number: MT47H128M16PK-25E IT:C
• Manufacturer: Micron Technology Inc

Specifications of MT47H128M16PK-25E IT:C

• Lead Free Status / Rohs Status: Not Compliant

Figure 11: 60-Ball FBGA Package (9mm x 11.5mm) – x4, x8
PDF: 09005aef824f87b6
2gbddr2.pdf – Rev. E 06/10 EN
Solder ball material:
SAC305 (96.5% Sn,
3% Ag, 0.5% Cu).
Dimensions apply to
solder balls post-
reflow on Ø0.35
SMD ball pads.
Seating
60X Ø0.45
plane
8 CTR
0.12 A
0.8 TYP
Note:
A
9 8 7
1. All dimensions are in millimeters.
1.8 CTR
6.4 CTR
0.8 TYP
9 ±0.1
3 2 1
A
B
C
D
E
F
G
H
J
K
L
0.8 ±0.05
22
Ball A1 ID
11.5 ±0.1
0.155
Micron Technology, Inc. reserves the right to change products or specifications without notice.
2Gb: x4, x8, x16 DDR2 SDRAM
0.25 MIN
1.2 MAX
© 2006 Micron Technology, Inc. All rights reserved.
Ball A1 ID
Packaging