EVALADG888EB Analog Devices Inc, EVALADG888EB Datasheet - Page 13

• Manufacturer Part Number: EVALADG888EB
• Manufacturer: Analog Devices Inc

Specifications of EVALADG888EB

• Lead Free Status / Rohs Status: Not Compliant

ORDERING GUIDE
Model
ADG888YRUZ
ADG888YRUZ-REEL
ADG888YRUZ-REEL7
ADG888YCPZ-REEL
ADG888YCPZ-REEL7
ADG888BCBZ-REEL
ADG888BCBZ-REEL7
EVAL-ADG888EB
1
2
Branding on these packages is limited to three characters due to space constraints.
Z = Pb-free part.
2
2
2
2
2
2
2
Temperature Range
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +85°C
−40°C to +85°C
Package Description
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
16-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
16-Ball Wafer Level Chip Scale Package [WLCSP]
16-Ball Wafer Level Chip Scale Package [WLCSP]
Evaluation Board
Rev. A | Page 13 of 16
Package Option
RU-16
RU-16
RU-16
CP-16-4
CP-16-4
CB-16
CB-16
ADG888
Branding
S0D
S0D
S02
S02
1