TDA9817 NXP Semiconductors, TDA9817 Datasheet - Page 38

• Manufacturer Part Number: TDA9817
• Manufacturer: NXP Semiconductors

Specifications of TDA9817

• Lead Free Status / Rohs Status: Compliant

Philips Semiconductors
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Typical dwell time of the leads in the wave ranges from
3 to 4 seconds at 250 C or 265 C, depending on solder
material applied, SnPb or Pb-free respectively.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
2004 Jun 29
Single/multistandard VIF/SIF-PLL and
FM-PLL/AM demodulators
38
M
Fix the component by first soldering two
diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300 C. When using a dedicated tool, all other leads can
be soldered in one operation within 2 to 5 seconds
between 270 and 320 C.
ANUAL SOLDERING
TDA9817; TDA9818
Product specification