1323XDSK-BDM Freescale Semiconductor, 1323XDSK-BDM Datasheet - Page 20

• Manufacturer Part Number: 1323XDSK-BDM
• Description: 1323X DEVELOPER KIT BDM
• Manufacturer: Freescale Semiconductor
• Series: -r
• Type: Transceiver, Microcontrollerr

Specifications of 1323XDSK-BDM

• Frequency: 2.4GHz
• Kit Application Type: Wireless Connectivity
• Application Sub Type: RF Transceiver
• Rohs Compliant: Yes
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• For Use With/related Products: MC1323x

11 Electrical Specifications
This section details maximum ratings for the 48-pin LGA package, recommended operating conditions,
DC characteristics, and AC characteristics.
11.1
Absolute maximum ratings are stress ratings only, and functional operation at the maximum rating is not
guaranteed. Stress beyond the limits specified in
damage to the device. For functional operating conditions, refer to the remaining tables in this section.
This device contains circuitry protecting against damage due to high static voltage or electrical fields;
however, it is advised that normal precautions be taken to avoid application of any voltages higher than
maximum-rated voltages to this high-impedance circuit. Reliability of operation is enhanced if unused
inputs are tied to an appropriate logic voltage level (for instance, either V
programmable pull-up resistor associated with the pin is enabled.
Table 3
11.2
Although damage from electrostatic discharge (ESD) is much less common on these devices than on early
CMOS circuits, normal handling precautions should be used to avoid exposure to static discharge.
Qualification tests are performed to ensure that these devices can withstand exposure to reasonable levels
of static without suffering any permanent damage.
All ESD testing is in conformity with the JESD22 Stress Test Qualification for Commercial Grade
Integrated Circuits. During the device qualification ESD stresses were performed for the human body
model (HBM), the machine model (MM) and the charge device model (CDM).
20
Maximum Junction Temperature
Storage Temperature Range
Moisture Sensitivity Level
Reflow Soldering Temperature
Power Supply Voltage
Digital Input Voltage
RF Input Power
Note: Maximum Ratings are those values beyond which damage to the device may occur.
Note: Meets ESD Human Body Model (HBM) = 2 kV
Functional operation should be restricted to the limits in the Electrical Characteristics
or Recommended Operating Conditions tables.
shows the maximum ratings for the 48-Pin LGA package.
Package Maximum Ratings
ESD Protection and Latch-Up Immunity
Rating
Table 3. LGA Package Maximum Ratings
MC1323x Advance Information, Rev. 1.2
Table 3
may affect device reliability or cause permanent
Symbol
V
P
T
Vin
BATT
T
max
stg
J
SS
or V
BATT
-0.3 to (V
Freescale Semiconductor
MSL3-260
-0.3 to 3.7
) or the
Value
125
125
260
10
DD
+ 0.3)
dBm
Unit
Vdc
Vdc
°C
°C
°C