PIC32MX575F512LT-80V/BG Microchip Technology, PIC32MX575F512LT-80V/BG Datasheet - Page 43
![512 KB Flash, 64 KB RAM, USB-OTG, CAN, 80 MHz, 10-Bit ADC, DMA 121 XBGA 10x10x1.](/photos/40/62/406286/landingpagemicrochippic32_sml.jpg)
PIC32MX575F512LT-80V/BG
Manufacturer Part Number
PIC32MX575F512LT-80V/BG
Description
512 KB Flash, 64 KB RAM, USB-OTG, CAN, 80 MHz, 10-Bit ADC, DMA 121 XBGA 10x10x1.
Manufacturer
Microchip Technology
Series
PIC® 32MXr
Datasheet
1.PIC32MX575F256H-80VPT.pdf
(256 pages)
Specifications of PIC32MX575F512LT-80V/BG
Processor Series
PIC32MX5xx
Core
MIPS
Data Bus Width
32 bit
Program Memory Type
Flash
Program Memory Size
512 KB
Data Ram Size
64 KB
Interface Type
USB, I2C, UART, RS-232, RS-485, SPI
Maximum Clock Frequency
80 MHz
Number Of Programmable I/os
5
Number Of Timers
5
Operating Supply Voltage
2.3 V to 3.6 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
Package / Case
XBGA-100
Operating Temperature Range
- 40 C to + 85 C
Supply Current (max)
10 mA
Core Processor
MIPS32® M4K™
Core Size
32-Bit
Speed
80MHz
Connectivity
CAN, I²C, SPI, UART/USART, USB OTG
Peripherals
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number Of I /o
-
Eeprom Size
-
Ram Size
64K x 8
Voltage - Supply (vcc/vdd)
2.3 V ~ 3.6 V
Data Converters
A/D 16x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 105°C
Lead Free Status / Rohs Status
Details
Available stocks
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Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PIC32MX575F512LT-80V/BG
Manufacturer:
Microchip Technology
Quantity:
10 000
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2.0
2.1
Getting started with the PIC32MX5XX/6XX/7XX family
of 32-bit Microcontrollers (MCUs) requires attention to
a minimal set of device pin connections before pro-
ceeding with development. The following is a list of pin
names, which must always be connected:
• All V
• All AV
• V
• MCLR pin
• PGECx/PGEDx pins used for In-Circuit Serial
• OSC1 and OSC2 pins when external oscillator
The following pin may be required, as well:
V
for ADC module is implemented
© 2009-2011 Microchip Technology Inc.
REF
(see
not used
(see
(see
Regulator (V
(see
Programming™ (ICSP™) and debugging
purposes
(see
source is used
(see
Note:
Note 1: This data sheet summarizes the features
CAP
+/V
DD
Section 2.2 “Decoupling
Section 2.2 “Decoupling
Section 2.3 “Capacitor on Internal Voltage
Section 2.4 “Master Clear (MCLR)
Section 2.5 “ICSP
Section 2.8 “External Oscillator
/V
REF
DD
2: Some registers and associated bits
GUIDELINES FOR GETTING
STARTED WITH 32-BIT
MICROCONTROLLERS
Basic Connection Requirements
CORE
and V
and AV
- pins used when external voltage reference
The AV
connected, regardless of the ADC use
and the ADC voltage reference source.
of the PIC32MX5XX/6XX/7XX family of
devices. It is not intended to be a
comprehensive reference source. To
complement the information in this data
sheet, refer to the related section of the
“PIC32 Family Reference Manual”, which
is available from the Microchip web site
(www.microchip.com/PIC32).
described in this section may not be
available on all devices. Refer to
Section 4.0 “Memory Organization”
this data sheet for device-specific register
and bit information.
pin
CAP
SS
SS
pins
/V
DD
pins even if the ADC module is
CORE
and AV
)”)
Pins”)
SS
Capacitors”)
Capacitors”)
pins must be
Pins”)
Pin”)
in
PIC32MX5XX/6XX/7XX
2.2
The use of decoupling capacitors on power supply
pins, such as V
See
Consider the following criteria when using decoupling
capacitors:
• Value and type of capacitor: A value of 0.1 µF
• Placement on the printed circuit board: The
• Handling high frequency noise: If the board is
• Maximizing performance: On the board layout
(100 nF), 10-20V is recommended. The capacitor
should be a low Equivalent Series Resistance
(low-ESR) capacitor and have resonance fre-
quency in the range of 20 MHz and higher. It is
further recommended to use ceramic capacitors.
decoupling capacitors should be placed as close
to the pins as possible. It is recommended that
the capacitors be placed on the same side of
the board as the device. If space is constricted,
the capacitor can be placed on another layer on
the PCB using a via; however, ensure that the
trace length from the pin to the capacitor is
within one-quarter inch (6 mm) in length.
experiencing high frequency noise, upward of
tens of MHz, add a second ceramic-type capacitor
in parallel to the above described decoupling
capacitor. The value of the second capacitor can
be in the range of 0.01 µF to 0.001 µF. Place this
second capacitor next to the primary decoupling
capacitor. In high-speed circuit designs, consider
implementing a decade pair of capacitances as
close to the power and ground pins as possible.
For example, 0.1 µF in parallel with 0.001 µF.
from the power supply circuit, run the power and
return traces to the decoupling capacitors first,
and then to the device pins. This ensures that the
decoupling capacitors are first in the power chain.
Equally important is to keep the trace length
between the capacitor and the power pins to a
minimum, thereby reducing PCB track
inductance.
Figure
Decoupling Capacitors
2-1.
DD
, V
SS
, AV
DD
and AV
DS61156G-page 43
SS
is required.
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