ESD7004MUTAG ON Semiconductor, ESD7004MUTAG Datasheet - Page 9

TVS Diodes - Transient Voltage Suppressors Low Capacitance ESD Protection Diode

ESD7004MUTAG

Manufacturer Part Number
ESD7004MUTAG
Description
TVS Diodes - Transient Voltage Suppressors Low Capacitance ESD Protection Diode
Manufacturer
ON Semiconductor
Series
-r
Datasheet

Specifications of ESD7004MUTAG

Polarity
Unidirectional
Channels
4 Channels
Clamping Voltage
10 V
Package / Case
UDFN-10
Breakdown Voltage
5.5 V
Termination Style
SMD/SMT
Capacitance
0.4 pF
Maximum Operating Temperature
+ 125 C
Minimum Operating Temperature
- 55 C
Dimensions
1 mm W x 2.5 mm L x 0.55 mm H
Mounting Style
SMD/SMT
Voltage - Reverse Standoff (typ)
5V
Voltage - Breakdown
5.5V
Power (watts)
-
Polarization
4 Channel Array - Unidirectional
Mounting Type
Surface Mount
Rohs Compliant
YES
Diode Type
Low Capacitance / ESD Protection
Clamping Voltage Vc Max
15.6V
Diode Case Style
UDFN
No. Of Pins
10
Svhc
No SVHC (20-Jun-2011)
Lead Free Status / Rohs Status
 Details

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
ESD7004MUTAG
Manufacturer:
ON
Quantity:
69 900
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Manufacturer:
ON Semiconductor
Quantity:
1 950
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Company:
Part Number:
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Company:
Part Number:
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Quantity:
30 000
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
P.O. Box 5163, Denver, Colorado 80217 USA
Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada
Email: orderlit@onsemi.com
10X
ON Semiconductor and
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
2X
2X
REFERENCE
0.10 C
0.08 C
PIN ONE
DETAIL A
0.10 C
0.10 C
2X
e
Í Í Í
Í Í Í
b2
BOTTOM VIEW
10
1
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
TOP VIEW
SIDE VIEW
DETAIL B
D
5
6
A1
A3
A
8X
b
10X
B
E
0.10 C
0.05 C
L
A
C
N. American Technical Support: 800−282−9855 Toll Free
Europe, Middle East and Africa Technical Support:
Japan Customer Focus Center
PACKAGE DIMENSIONS
USA/Canada
Phone: 421 33 790 2910
Phone: 81−3−5773−3850
SEATING
PLANE
A
NOTE 3
UDFN10 2.5x1, 0.5P
http://onsemi.com
CASE 517BB−01
B
L1
ISSUE O
EXPOSED Cu
9
A1
CONSTRUCTIONS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DETAIL A
Ç Ç Ç
É É É
É É É
OPTIONAL
CONSTRUCTION
DETAIL B
OPTIONAL
PACKAGE
L
OUTLINE
0.50
10X
SOLDERING FOOTPRINT*
MOLD CMPD
0.50
PITCH
A3
RECOMMENDED
L
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
NOTES:
1. DIMENSIONING AND TOLERANCING PER
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
ASME Y14.5M, 1994.
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.30mm FROM TERMINAL.
DIM
A1
A3
b2
L1
A
D
b
E
e
L
2X
DIMENSIONS: MILLIMETERS
0.45
MILLIMETERS
0.45
0.00
0.15
0.35
0.30
MIN
---
0.13 REF
2.50 BSC
1.00 BSC
0.50 BSC
8X
1.30
0.25
MAX
0.55
0.05
0.25
0.45
0.40
0.05
ESD7004/D

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