RC48F4400P0TB0EA Micron Technology Inc, RC48F4400P0TB0EA Datasheet - Page 59
RC48F4400P0TB0EA
Manufacturer Part Number
RC48F4400P0TB0EA
Description
Manufacturer
Micron Technology Inc
Datasheet
1.RC48F4400P0TB0EA.pdf
(88 pages)
Specifications of RC48F4400P0TB0EA
Cell Type
NOR
Density
512Mb
Interface Type
Parallel/Serial
Boot Type
Bottom
Address Bus
25b
Operating Supply Voltage (typ)
2.5/3/3.3V
Operating Temp Range
-40C to 85C
Package Type
EZBGA
Sync/async
Async/Sync
Operating Temperature Classification
Industrial
Operating Supply Voltage (min)
2.3V
Operating Supply Voltage (max)
3.6V
Word Size
16b
Number Of Words
32M
Supply Current
31mA
Mounting
Surface Mount
Pin Count
64
Lead Free Status / Rohs Status
Not Compliant
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P33-65nm
16.0
16.1
Figure 28: Decoder for Discrete Products
Note:
Table 26: Valid Combinations for Discrete Products
Datasheet
59
Device Density
Product Line Designator
Package Designator
256 = 256-Mbit
TE = 56 -Lead TSOP , leaded
JS = 56-Lead TSOP , lead-free
RC = 64-Ball Easy BGA, leaded
PC = 64-Ball Easy BGA, lead-free
28F = Numonyx™ Flash Memory
The last digit is randomly assigned to cover packing media and/or features or other specific configuration.
RC28F256P33TF*
RC28F256P33BF*
PC28F256P33TF*
PC28F256P33BF*
JS28F256P33TF*
JS28F256P33BF*
256-Mbit
Ordering Information
Discrete Products
J
S 2
8
F 2 5
6
P 3 3 B
F *
Device Features*
Product Family
Device Details
Parameter Location
P 33 = Numonyx
V
V
B = Bottom Parameter
T = Top Parameter
65 nm lithography
CC
CCQ
= 2. 3– 3. 6V
= 2. 3– 3. 6 V
®
Axcell™ Flash Memory (P33)
Order Number:320003-09
Mar 2010
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