RC48F4400P0TB0EA Micron Technology Inc, RC48F4400P0TB0EA Datasheet - Page 9

• Manufacturer Part Number: RC48F4400P0TB0EA
• Manufacturer: Micron Technology Inc

Specifications of RC48F4400P0TB0EA

• Cell Type: NOR
• Density: 512Mb
• Interface Type: Parallel/Serial
• Boot Type: Bottom
• Address Bus: 25b
• Operating Supply Voltage (typ): 2.5/3/3.3V
• Operating Temp Range: -40C to 85C
• Package Type: EZBGA
• Sync/async: Async/Sync
• Operating Temperature Classification: Industrial
• Operating Supply Voltage (min): 2.3V
• Operating Supply Voltage (max): 3.6V
• Word Size: 16b
• Number Of Words: 32M
• Supply Current: 31mA
• Mounting: Surface Mount
• Pin Count: 64
• Lead Free Status / Rohs Status: Not Compliant

P33-65nm
Table 2:
2.2
Figure 3:
Datasheet
9
Product Information
Lead Count
Lead Tip Angle
Seating Plane Coplanarity
Lead to Package Offset
Notes:
1.
2.
3.
E
Ball A1
Corner
One dimple on package denotes Pin 1.
If two dimples, then the larger dimple denotes Pin 1.
Pin 1 will always be in the upper left corner of the package, in reference to the product mark.
A2
C
D
E
G
H
A
B
F
TSOP Package Dimensions (Sheet 2 of 2)
Easy BGA Mechanical Specifications (256-Mbit, 512-Mbit)
64-Ball Easy BGA Package
1
Top View - Ball side down
A1
2
3
Symbol
N
Y
Z
θ
4
D
5
6
0.150
Min
0°
-
-
7
Millimeters
8
0.250
Nom
56
3°
-
A
A
G
B
C
D
E
F
H
0.100
0.350
Max
8
Seating
5°
Plane
-
Bottom View - Ball Side Up
7
6
0.006
Min
0°
-
-
5
Note: Drawing not to scale
4
Inches
0.010
Nom
3
56
3°
-
2
Order Number:320003-09
1
Y
0.004
0.014
Max
S1
5°
-
Ball A1
Corner
b
e
S2
Mar 2010
Note