HIN213CA Intersil, HIN213CA Datasheet - Page 15

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HIN213CA

Manufacturer Part Number
HIN213CA
Description
IC 4DRVR/5RCVR RS232 5V 28-SSOP
Manufacturer
Intersil
Type
Transceiverr
Datasheet

Specifications of HIN213CA

Number Of Drivers/receivers
4/5
Protocol
RS232
Voltage - Supply
4.5 V ~ 5.5 V
Mounting Type
Surface Mount
Package / Case
28-SSOP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant

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Small Outline Plastic Packages (SOIC)
NOTES:
10. Controlling dimension: MILLIMETER. Converted inch dimensions are
N
1
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate burrs.
4. Dimension “E” does not include interlead flash or protrusions. Interlead
5. The chamfer on the body is optional. If it is not present, a visual index
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater above
0.25(0.010)
Publication Number 95.
Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006
inch) per side.
flash and protrusions shall not exceed 0.25mm (0.010 inch) per side.
feature must be located within the crosshatched area.
the seating plane, shall not exceed a maximum value of 0.61mm (0.024
inch)
not necessarily exact.
2
-A-
INDEX
AREA
3
e
B
D
M
C A
SEATING PLANE
M
E
-C-
-B-
B S
A
15
HIN202, HIN206, HIN207, HIN208, HIN211, HIN213
H
A1
α
0.10(0.004)
0.25(0.010)
M
L
h x 45°
B
M
C
M16.3
16 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE
SYMBOL
A1
A
B
C
D
E
H
N
α
e
h
L
(JEDEC MS-013-AA ISSUE C)
0.0926
0.0040
0.013
0.0091
0.3977
0.2914
0.394
0.010
0.016
MIN
0.050 BSC
INCHES
16
0.1043
0.0118
0.0200
0.0125
0.4133
0.2992
0.419
0.029
0.050
MAX
10.10
10.00
2.35
0.10
0.33
0.23
7.40
0.25
0.40
MILLIMETERS
MIN
1.27 BSC
16
10.50
10.65
2.65
0.30
0.51
0.32
7.60
0.75
1.27
MAX
Rev. 1 6/05
NOTES
9
3
4
5
6
7
-
-
-
-
-
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