LPC11C22FBD48/301,151 NXP Semiconductors, LPC11C22FBD48/301,151 Datasheet - Page 38
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LPC11C22FBD48/301,151
Manufacturer Part Number
LPC11C22FBD48/301,151
Description
Microcontrollers (MCU) CAN Transceiver MCU 16K Flash
Manufacturer
NXP Semiconductors
Datasheet
1.LPC11C22FBD48301151.pdf
(62 pages)
Specifications of LPC11C22FBD48/301,151
Processor Series
LPC11Cx2
Core
ARM Cortex-M0
Data Bus Width
32 bit
Program Memory Type
Flash
Program Memory Size
16 KB
Data Ram Size
8 KB
Interface Type
CAN, I2C, SPI, UART
Maximum Clock Frequency
50 MHz
Number Of Programmable I/os
36
Number Of Timers
4
Operating Supply Voltage
3.3 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
Development Tools By Supplier
OM13012,598
Minimum Operating Temperature
- 40 C
Lead Free Status / Rohs Status
Details
Other names
935294284151
NXP Semiconductors
LPC11CX2_CX4
Product data sheet
Fig 9.
Fig 10. Deep-sleep mode: Typical supply current I
(1) System oscillator and system PLL disabled; IRC enabled.
(2) System oscillator and system PLL enabled; IRC disabled.
(mA)
(μA)
I
I
DD
DD
40
30
20
10
Conditions: V
SYSAHBCLKCTRL register (SYSAHBCLKCTRL = 0x1F); all peripheral clocks disabled; internal
pull-up resistors disabled; BOD disabled; pin CAN_RXD pulled LOW externally.
Sleep mode: Typical supply current I
clock frequencies
Conditions: BOD disabled; all oscillators and analog blocks disabled in the PDSLEEPCFG register
(PDSLEEPCFG = 0x0000 18FF); pin CAN_RXD pulled LOW externally.
supply voltages V
8
6
4
2
0
0
−40
−40
All information provided in this document is subject to legal disclaimers.
DD
= 3.3 V; sleep mode entered from flash; all peripherals disabled in the
−15
−15
Rev. 3 — 27 June 2011
DD
10
10
DD
versus temperature for different system
32-bit ARM Cortex-M0 microcontroller
35
35
DD
versus temperature for different
48 MHz
36 MHz
24 MHz
12 MHz
LPC11Cx2/Cx4
(2)
(2)
(2)
(1)
60
60
temperature (°C)
temperature (°C)
3.6 V
3.3 V
2.0 V
1.8 V
002aaf392
002aaf394
© NXP B.V. 2011. All rights reserved.
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