MAXQ1004-B01+ Maxim Integrated Products, MAXQ1004-B01+ Datasheet - Page 4

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MAXQ1004-B01+

Manufacturer Part Number
MAXQ1004-B01+
Description
Microcontrollers (MCU) 1-Wire and SPI Authentication MCU
Manufacturer
Maxim Integrated Products
Datasheets

Specifications of MAXQ1004-B01+

Processor Series
MAXQ1004
Core
RISC
Data Bus Width
16 bit
Program Memory Type
Flash
Program Memory Size
16 KB
Data Ram Size
640 B
Interface Type
1-Wire, SPI, JTAG, TAP
Maximum Clock Frequency
6 MHz
Number Of Timers
1
Operating Supply Voltage
1.7 V to 3.6 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
Package / Case
TQFN-EP-16
Development Tools By Supplier
MAXQ1004-KIT
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit
Lead Free Status / Rohs Status
 Details
1-Wire and SPI Authentication Microcontroller
ABSOLUTE MAXIMUM RATINGS
Voltage Range on All Pins (including V
Voltage Range on DQ Relative to GND ...............-0.5V to +6.0V
Continuous Output Current
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
RECOMMENDED DC OPERATING CONDITIONS
(V
erwise noted.) (Note 1)
4
Supply Voltage
1.8V Internal Regulator
Power-On Reset Voltage
Power-Fail Reset Voltage
Power-Fail Warning Voltage
Digital Overvoltage Detect
Supply Current (Note 5)
Stop-Mode Current (Note 5)
DIGITAL I/O
Input High Voltage (P0, RST)
Input Hysteresis
Input Low Voltage (P0, RST)
Output Low Voltage (P0, RST)
(Note 7)
Output High Voltage (P0, RST)
Input Leakage Current
Input/Output Pin Capacitance
Input Low Current for All Pins
RST Pullup Resistor
except DQ to GND ............................................-0.5V to +3.6V
Any Single I/O Pin ...........................................................35mA
All I/O Pins Combined .....................................................35mA
DD
= 1.7V to 3.6V, T
PARAMETER
A
= -40NC to +85NC, unless otherwise noted. Typical values are at T
DD
SYMBOL
V
),
I
I
I
I
STOP1
STOP2
STOP3
STOP4
V
V
V
REG18
V
R
I
I
V
V
V
V
C
DD1
DD2
V
IHYS
V
POR
PFW
RST
I
RST
DD
OH
I
HV
OL
IL
IH
IL
L
IO
(Note 2)
(Notes 3, 4)
Monitors V
Device is executing
from flash
T
T
T
T
(Note 6)
V
V
I
Internal pullup disabled
(Note 6)
V
OH
A
A
A
A
DD
DD
IN
= +25NC, CPU not backed up
= +85NC, CPU not backed up
= +25NC, CPU backed up
= +85NC, CPU backed up
= 0.4V, pullup enabled
= -2mA
= 3.6V, I
= 1.85V, I
REG18
CONDITIONS
OL
OL
Continuous Power Dissipation (T
Operating Temperature Range .......................... -40NC to +85NC
Storage Temperature Range ............................ -65NC to +150NC
Lead Temperature (soldering, 10s) ................................+300NC
Soldering Temperature (reflow) ......................................+260NC
Single-Layer Board (derate 16.9mW/NC above +70NC) .. 1349.1mW
= 4mA (Note 6)
Multilayer Board (derate 25mW/NC above +70NC) ....2000mW
= 4mA
f
f
SYS
SYS
= 6MHz
= 1MHz
A
V
V
V
0.7 x
1.62
1.64
1.75
-100
= +25NC and V
MIN
V
1.0
2.4
0.4
GND
DD
RST
DD
-
A
= +70NC)
TYP
3.3
1.8
0.8
0.3
65
DD
= 3.3V, unless oth-
Q20%
1.695
MAX
+100
0.3 x
1.98
1.42
1.85
V
V
V
3.6
2.8
3.5
7.5
6.5
0.4
0.4
-70
15
DD
DD
DD
5
9
UNITS
mA
FA
nA
FA
kI
pF
V
V
V
V
V
V
V
V
V
V
V

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