TDA1517/N3 NXP Semiconductors, TDA1517/N3 Datasheet - Page 2
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TDA1517/N3
Manufacturer Part Number
TDA1517/N3
Description
AMP, STEREO 2 X 6W, SIL9MPF-9, 1517
Manufacturer
NXP Semiconductors
Datasheet
1.TDA1517N3112.pdf
(15 pages)
Specifications of TDA1517/N3
Amplifier Class
B
No. Of Channels
2
Output Power
6W
Supply Voltage Range
6V To 18V
Thd + N
0.1% @ 1W, 4ohm, VDD=14.4V
Load Impedance
4ohm
Operating Temperature Range
-40°C To +85°C
Rohs Compliant
Yes
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
TDA1517/N3
Manufacturer:
CYPRESS
Quantity:
310
Company:
Part Number:
TDA1517/N3
Manufacturer:
NXP
Quantity:
748
Company:
Part Number:
TDA1517/N3
Manufacturer:
INTEL
Quantity:
3
Part Number:
TDA1517/N3+112
Manufacturer:
NXP/恩智浦
Quantity:
20 000
NXP Semiconductors
FEATURES
• Requires very few external components
• High output power
• Fixed gain
• Good ripple rejection
• Mute/standby switch
• AC and DC short-circuit safe to ground and V
• Thermally protected
• Reverse polarity safe
• Capability to handle high energy on outputs (V
• No switch-on/switch-off plop
• Electrostatic discharge protection.
QUICK REFERENCE DATA
ORDERING INFORMATION
2004 Feb 18
V
I
I
I
I
|Z
P
SVRR
α
G
V
T
TDA1517/N3
TDA1517/N3/S5
TDA1517P
TYPE NUMBER
ORM
q(tot)
sb
sw
cs
c
P
o
no(rms)
2 x 6 W stereo power amplifier
I
v
|
SYMBOL
supply voltage
repetitive peak output current
total quiescent current
standby current
switch-on current
input impedance
output power
supply voltage ripple rejection
channel separation
closed loop voltage gain
noise output voltage (RMS value)
crystal temperature
RBS9MPF
SIL9MPF
HDIP18
NAME
PARAMETER
plastic single in-line medium power package with fin; 9 leads
plastic rectangular-bent single in-line medium power package with
fin; 9 leads
plastic heat-dissipating dual in-line package; 18 leads
P
P
= 0 V)
R
R
f
i
L
L
= 100 Hz to 10 kHz
= 4 Ω; THD = 0.5%
= 4 Ω; THD = 10%
2
CONDITIONS
GENERAL DESCRIPTION
The TDA1517 is an integrated class-B dual output
amplifier in a plastic single in-line medium power package
with fin (SIL9MPF), a plastic rectangular-bent single in-line
medium power package with fin (RBS9MPF) or a plastic
heat-dissipating dual in-line package (HDIP18). The
device is primarily developed for multi-media applications.
DESCRIPTION
PACKAGE
6.0
−
−
−
−
50
−
−
48
40
19
−
−
MIN.
TDA1517; TDA1517P
14.4
−
40
0.1
−
−
5
6
−
−
20
50
−
TYP.
Product specification
18.0
2.5
80
100
40
−
−
−
−
−
21
−
150
MAX.
SOT110-1
SOT352-1
SOT398-1
VERSION
V
A
mA
μA
μA
kΩ
W
W
dB
dB
dB
μV
°C
UNIT