M95160-WMN3TP/S STMicroelectronics, M95160-WMN3TP/S Datasheet - Page 43

• Manufacturer Part Number: M95160-WMN3TP/S
• Manufacturer: STMicroelectronics

Specifications of M95160-WMN3TP/S

• Density: 16Kb
• Interface Type: Serial (SPI)
• Organization: 2Kx8
• Access Time (max): 60ns
• Frequency (max): 5MHz
• Write Protection: Yes
• Data Retention: 40Year
• Operating Supply Voltage (typ): 3.3/5V
• Operating Temp Range: -40C to 125C
• Supply Current: 2mA
• Operating Supply Voltage (min): 2.5V
• Operating Supply Voltage (max): 5.5V
• Operating Temperature Classification: Automotive
• Mounting: Surface Mount
• Pin Count: 8
• Lead Free Status / Rohs Status: Compliant

M95160-x, M95080-x
Figure 20. WLCSP-R 1.350 x 1.365 mm 0.4 mm pitch 8 bumps, package outline
1. Primary datum Z and seating plane are defined by the spherical crowns of the bump.
2. Drawing is not to scale.
3. Preliminary data.
Table 30.
1. Preliminary data.
2. Values in inches are converted from mm and rounded to 4 decimal digits.
3. Dimension is measured at the maximum bump diameter parallel to primary datum Z.
N (total number of
terminals)
Symbol
aaa
eee
b
A1
A2
e1
D
G
A
E
F
e
(3)
Orientation
reference
WLCSP-R 1.350 x 1.365 mm 0.4 mm pitch 8 bumps, package mechanical
data
eee Z
Bump
(1)
Wafer back side
0.545
0.190
0.355
0.270
1.350
1.365
0.400
0.800
0.282
0.275
Typ
D
b
Rotated 90˚
Doc ID 8028 Rev 10
Detail A
millimeters
0.490
0.240
0.110
0.060
Min
8
E
(×4)
A1
aaa
Seating plane
(see note 1)
A2
Side view
Z
0.600
0.300
1.475
1.490
Max
A
Detail A
Orientation
reference
C
B
A
0.0193
0.0075
0.0106
0.0531
0.0537
0.0157
0.0315
0.0111
0.0108
0.014
Typ
3
Bump side
Package mechanical data
e1
2
e
inches
0.0215
0.0094
0.0043
0.0024
1
Min
8
G
(2)
1C_ME
e
e1
F
0.0236
0.0118
0.0581
0.0587
Max
43/50